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浏览/检索结果: 共11条，第1-10条 帮助 限定条件 专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Tuning electronic properties of bilayer boron-phosphide by stacking order and electric field: A first principles investigation (EI收录) 会议 Wuhan, China, 作者:  Tan, Chunjian[1];  Zhou, Qiang[1];  Chen, Xianping[1] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 Chip scale packages  Electric fields  Electronic properties  Electronic structure  Electronics packaging  Monolayers   The study on optical interconnection and assembly technology based on long-rang surface plasmon polaritons grating (EI收录) 会议 Wuhan, China, 作者:  Wei, Qi-Qin[1];  Xiao, Jing[1];  Yang, Dao-Guo[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Chip scale packages  Diffraction gratings  Efficiency  Electric excitation  Electromagnetic wave polarization  Electronics packaging  Integrated circuit interconnects  Light sources  Optical interconnects  Phonons  Photons  Plasmons  Quantum theory  Reliability  Semiconductor lasers  Surface plasmon resonance   Performance analysis of pre-oxidation process direct bonding copper substrate (EI收录) 会议 Changsha, China, 作者:  Ning, Honglong[1,2];  Hu, Shiben[1];  Tao, Ruiqiang[1];  Liu, Xianzhe[1];  Zeng, Yong[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 Alumina  Chip scale packages  Copper  Electronics packaging  Interferometers  Oxidation  Oxidation resistance  Speckle   Reliability analysis and case studies on FCBGA packaged devices (EI收录) 会议 Changsha, China, 作者:  Lin, Xiao-Ling[1];  Xie, Shao-Feng[1];  Yao, Ruo-He[2] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 Chip scale packages  Cracks  Electronics packaging  Failure (mechanical)  Failure analysis  Field programmable gate arrays (FPGA)  Flip chip devices  Integrated circuit interconnects  Packaging  Reconfigurable hardware  Reliability  Soldered joints  Soldering  Soldering alloys  Thermal stress   Optimization for solder layer thermal characteristics of the power transistor based on structure function (EI收录) 会议 Changsha, China, 作者:  Xu, Wei[1,2];  Li, Guoyuan[1];  Zhou, Bin[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Chip scale packages  Electronics packaging  Numerical models  Outages  Power electronics  Power transistors  Shape optimization  Temperature  Transistors   High concentration Ag nano-particles ink preparation and related writing system for paper-based writing electronics (EI收录) 会议 Changsha, China, 作者:  Li, Jianping[1];  Mao, Peng[1];  Wang, Fuliang[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/11 Chip scale packages  Electronics packaging  Microelectronics  Nanoparticles  Silver   A novel process obtaining silicone dome lens for wafer level LED packaging (EI收录) 会议论文 2013 10th China International Forum on Solid State Lighting, ChinaSSL 2013, Beijing, China, November 10, 2013 - November 12, 2013 作者:  Jin, Peng[1];  Zou, Beibing[1];  Jiang, Liting[1];  Lei, Peng[1];  Liu, Wei[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 Chip scale packages  Domes  Light emitting diodes  Lighting  Silicon wafers  Silicones   A numerical method on thermal-humidity behavior of electronic packaging (EI收录) 会议论文 ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, August 8, 2011 - August 11, 2011 作者:  Mei, Yue[1];  Yao, Xiaohu[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 ABAQUS  Chip scale packages  Coupled circuits  Desorption  Driers (materials)  Finite element method  Hydrostatic pressure  Interfaces (materials)  Moisture  Packaging  Steel sheet  Vapor pressure  Vapors   Study of critical factors influencing the solidification undercooling behavior of Sn-3.0Ag-0.5Cu (SAC) lead-free solder and SAC/Cu joints (EI收录) 会议论文 ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, August 13, 2012 - August 16, 2012 作者:  Li, Xun-Ping[1,2];  Xia, Jian-Min[1];  Qin, Hong-Bo[1];  He, Xiao-Qi[2];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Chip scale packages  Differential scanning calorimetry  Silver  Soldered joints  Soldering alloys  Solidification  Undercooling   The optical design and simulation of multi-chip LED array package structure (EI收录) 会议论文 Proceedings of SPIE - The International Society for Optical Engineering, Beijing, China, October 18, 2010 - October 20, 2010 作者:  Wang, Hong[1,2];  Chen, Li[1];  Ye, Feifei[1];  Wang, Lijun[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/16 Chip scale packages  Light emitting diodes  Monte Carlo methods  Optical design  Packaging materials  Refractive index  Structural design  Systems analysis