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	Study of critical factors influencing the solidification undercooling behavior of Sn-3.0Ag-0.5Cu (SAC) lead-free solder and SAC/Cu joints (EI收录)
	Li, Xun-Ping[1,2]; Xia, Jian-Min[1]; Qin, Hong-Bo[1]; He, Xiao-Qi[2]; Zhang, Xin-Ping[1]
会议名称	ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging
会议日期	August 13, 2012 - August 16, 2012
会议地点	Guilin, China
关键词	Chip scale packages Differential scanning calorimetry Silver Soldered joints Soldering alloys Solidification Undercooling
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2055926
专题	华南理工大学
作者单位	1.[1] School of Materials Science and Engineering, South China University of Technology, Guangzhou 510640, China 2.[2] Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, 5th Electronics Research Institute, Ministry of Information Industry, Guangzhou 510610, China
推荐引用方式 GB/T 7714	Li, Xun-Ping[1,2],Xia, Jian-Min[1],Qin, Hong-Bo[1],等. Study of critical factors influencing the solidification undercooling behavior of Sn-3.0Ag-0.5Cu (SAC) lead-free solder and SAC/Cu joints (EI收录)[C]. 见:ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging. Guilin, China. August 13, 2012 - August 16, 2012.

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