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Fatigue lifetime analysis of the electronic packaging structures under the combined thermal stress and vibration loading conditions [热振加载条件下电子封装结构的疲劳寿命分析] 期刊论文
Xi'an Dianzi Keji Daxue Xuebao/Journal of Xidian University, 2019, 卷号: 46, 页码: 54-60
作者:  Zhao, F.;  Qiu, Y.;  Jia, F.;  Ma, H.
收藏  |  浏览/下载:2/0  |  提交时间:2019/12/30
Method to predict lifetime of IGBT under power cycling based-on fast electro-thermo-mechanical model 会议论文
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018
作者:  Jiang, M.;  Fu, G.;  Leng, H.;  Wan, B.;  Cheng, Y.
收藏  |  浏览/下载:6/0  |  提交时间:2019/12/30
Effects of surface modification on thermal cycling lifetime of thermal barrier coatings with HVOF NiCrAlY bond coat 期刊论文
PROGRESS IN NATURAL SCIENCE-MATERIALS INTERNATIONAL, 2012, 卷号: 22, 页码: 237-243
作者:  Ni, Liyong;  Zhou, Chungen
收藏  |  浏览/下载:10/0  |  提交时间:2020/01/06


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