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Method to predict lifetime of IGBT under power cycling based-on fast electro-thermo-mechanical model
Jiang, M.; Fu, G.; Leng, H.; Wan, B.; Cheng, Y.
2018
会议名称2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018
页码1-6
URL标识查看原文
内容类型会议论文
URI标识http://www.corc.org.cn/handle/1471x/5931659
专题北京航空航天大学
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GB/T 7714
Jiang, M.,Fu, G.,Leng, H.,et al. Method to predict lifetime of IGBT under power cycling based-on fast electro-thermo-mechanical model[C]. 见:2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018.
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