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浏览/检索结果: 共3条，第1-3条 帮助 限定条件 专题：大连理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 4359-4369 作者:  Huang, Ru;  Ma, Haoran;  Shang, Shengyan;  Kunwar, Anil;  Wang, Yunpeng 收藏  |  浏览/下载：26/0  |  提交时间：2019/12/02 Chip scale packages  Copper  Copper alloys  Flip chip devices  Grain boundaries  Growth rate  Size determination  Soldered joints  Substrates  Tin alloys, Electronic product  Grain boundary motions  Interface reactions  Lateral growth rates  Longitudinal growth  Packaging process  Packaging technologies  Solder composition, Soldering   Drop Failure Modes of A Wafer-Level Chip-Scale Packaging 会议论文 14th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Dalian, PEOPLES R CHINA, 2013-08-11 作者:  Huang, Mingliang;  Liu, Shuang;  Zhao, Ning;  Long, Haohui;  Li, Jianhui 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/11 Sn-3Ag-0.5Cu solder joint  board-level drop reliability  failure mode  wafer-level chip-scale packaging (WLCSP)  intermetallic compound (IMC)   Laser-Driven Micro Transfer Placement of Prefabricated Microstructures 期刊论文 JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2012, 卷号: 21, 页码: 1049-1058 作者:  Saeidpourazar, Reza;  Li, Rui;  Li, Yuhang;  Sangid, Michael D.;  Lu, Chaofeng 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/13 Chip-scale packaging  flexible electronics  microassembly  micro-manipulation  printed microelectromechanical systems