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浏览/检索结果: 共5条，第1-5条 帮助 限定条件 专题：大连理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Investigation on Material Removal Uniformity in Electrochemical Mechanical Polishing by Polishing Pad with Holes 期刊论文 ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2019, 卷号: 8, 页码: P3047-P3052 作者:  Liu, Zuotao;  Jin, Zhuji;  Wu, Di;  Guo, Jiang 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02 On the reaction mechanism of a hydroxyethylidene diphosphonic acid-based electrolyte for electrochemical mechanical polishing of copper 期刊论文 ELECTROCHEMISTRY COMMUNICATIONS, 2019, 卷号: 103, 页码: 48-54 作者:  Wu, Di;  Kang, Renke;  Guo, Jiang;  Liu, Zuotao;  Wan, Ce 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02 Hydroxyethylidene diphosphonic acid  Electrochemical mechanical polishing  Copper  Reaction mechanism   Two-step electrochemical mechanical polishing of pure copper 期刊论文 ECS Journal of Solid State Science and Technology, 2019, 卷号: 8, 页码: P699-P703 作者:  Wu, Di;  Kang, Renke;  Niu, Lin;  Pan, Bo;  Liu, Zuotao 收藏  |  浏览/下载：14/0  |  提交时间：2019/12/02 Electrochemical Mechanical Polishing of Copper with High Permittivity Abrasives 期刊论文 MATERIALS AND MANUFACTURING PROCESSES, 2013, 卷号: 28, 页码: 207-212 作者:  Li, Weisi;  Guo, Dongming;  Jin, Zhuji;  Wang, Zhe;  Yuan, Zewei 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/11 Abrasives  CMP  Copper  ECMP  Electrochemistry  Permittivity  SiO2  TiO2   Surface quality prediction and processing parameter determination in electrochemical mechanical polishing of bearing rollers 期刊论文 INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2012, 卷号: 63, 页码: 129-136 作者:  Xu, Wenji;  Wei, Zefei;  Sun, Jing;  Wei, Lei;  Yu, Ziyuan 收藏  |  浏览/下载：6/0  |  提交时间：2019/12/13 Bearing roller  Electrochemical mechanical polishing  Least squares support vector machines  Prediction