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	Two-step electrochemical mechanical polishing of pure copper
	Wu, Di; Kang, Renke; Niu, Lin; Pan, Bo; Liu, Zuotao; Guo, Jiang
刊名	ECS Journal of Solid State Science and Technology
	2019
卷号	8页码:P699-P703
ISSN号	21628769
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3222780
专题	大连理工大学
作者单位	Key Laboratory for Precision, Non-Traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian, 116024, China
推荐引用方式 GB/T 7714	Wu, Di,Kang, Renke,Niu, Lin,et al. Two-step electrochemical mechanical polishing of pure copper[J]. ECS Journal of Solid State Science and Technology,2019,8:P699-P703.
APA	Wu, Di,Kang, Renke,Niu, Lin,Pan, Bo,Liu, Zuotao,&Guo, Jiang.(2019).Two-step electrochemical mechanical polishing of pure copper.ECS Journal of Solid State Science and Technology,8,P699-P703.
MLA	Wu, Di,et al."Two-step electrochemical mechanical polishing of pure copper".ECS Journal of Solid State Science and Technology 8(2019):P699-P703.

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