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兰州理工大学 [47]

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期刊论文 [47]

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限定条件	专题：兰州理工大学第一署名单位第一作者单位通讯作者单位

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	Plasma arc welding-brazing of aluminum to copper with SiO2 nanoparticles strengthening 期刊论文 JOURNAL OF MANUFACTURING PROCESSES, 2021, 卷号: 69, 页码: 253-260 作者: Fan, Ding; Yang, Nan; Huang, Jiankang; Yu, Xiaoquan 收藏 \| 浏览/下载：3/0 \| 提交时间：2021/10/14 Aluminum-copper dissimilar metals Plasma arc welding-brazing SiO2 nanoparticles Intermetallic compound Mechanical properties
	Effects of SnO2 Nanoparticles on Microstructure and Intermetallic Compounds of Sn0.6Cu Solder 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 12, 页码: 4297-4302 作者: Yu, Weiyuan; Sun, Jungang; Liu, Yun; B., Wu; Z., Lei 收藏 \| 浏览/下载：8/0 \| 提交时间：2022/02/17 Binary alloys Brazing Brazing filler metals Grain size and shape Intermetallics Melting point Microstructure Nanoparticles Synthesis (chemical) Brazing joints Composite solders Crystal planes Driving forces Interfacial intermetallics Liquidus temperature Melting process Melting properties
	Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin 期刊论文 Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597 作者: Sun, Xuemin; Yu, Weiyuan; Wang, Yanhong 收藏 \| 浏览/下载：2/0 \| 提交时间：2022/02/17 Activation energy Copper Liquids Microelectronics Soldering Thermal gradients Tin Ultrasonics Copper dissolution Development trends Dissolution kinetics Dissolution rates Enhanced dissolutions Microelectronic products Multifunctionality Sound pressure distribution
	Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin 期刊论文 Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597 作者: Sun, Xuemin; Yu, Weiyuan; Wang, Yanhong 收藏 \| 浏览/下载：8/0 \| 提交时间：2020/11/14 Activation energy Copper Liquids Microelectronics Soldering Thermal gradients Tin Ultrasonics Copper dissolution Development trends Dissolution kinetics Dissolution rates Enhanced dissolutions Microelectronic products Multifunctionality Sound pressure distribution
	Effect of post-weld annealing on microstructure and growth behavior of copper/aluminum friction stir welded joint 期刊论文 Materials, 2020, 卷号: 13, 期号: 20, 页码: 1-17 作者: Jin, Yuhua; Wu, Bo; Lu, Xuetian; Xing, Yichu; Zhou, Zizheng 收藏 \| 浏览/下载：2/0 \| 提交时间：2020/11/14 Aluminum Aluminum alloys Annealing Binary alloys Copper Copper alloys Friction Intermetallics Microstructure Research laboratories Welds Annealing temperatures Friction stir welded joints Growth mechanisms Interface mi-crostructure Layered Structures Original structures Post-weld annealing Softening phenomenon
	Kinetics of Copper Dissolution in Liquid Tin by Direct Current 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 10, 页码: 3425-3432 作者: Sun, Xuemin; Yu, Weiyuan; Wu, Baolei; Yang, Guoqing; Liu, Yun 收藏 \| 浏览/下载：7/0 \| 提交时间：2022/02/17 Activation energy Copper Liquids Rate constants Tin Comsol multiphysics Copper dissolution Direct current Dissolution kinetics Dissolution rates Effective charge Immersion method Temperature range
	Shear strength and fracture surface analysis of lead-free solder joints with high fraction of IMCs 期刊论文 Vacuum, 2020, 卷号: 180 作者: Qiu, Hongyu; Hu, Xiaowu; Li, Shuang; Wan, Yongqiang; Li, Qinglin 收藏 \| 浏览/下载：2/0 \| 提交时间：2020/11/14 Binary alloys Copper alloys Elastic moduli Fracture Fracture mechanics Shear flow Soldered joints Surface analysis Tin alloys Area ratios Fracture mechanisms Fracture surface analysis Fracture surfaces Fractured surfaces Isothermal aging Lead-free solder joint Solder joints
	Influences of different barrier films on microstructures and electrical properties of Bi2Te3-based joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 17, 页码: 14714-14729 作者: Cheng, Jinxuan; Hu, Xiaowu; Li, Qinglin 收藏 \| 浏览/下载：17/0 \| 提交时间：2020/11/14 Bismuth compounds Diffusion barriers Gold Gold compounds Heat resistance Microstructure Nickel Open circuit voltage Soldering Barrier films Diffusion barrier films Electrical resistances Output current Reflow--soldering Solder joints Temperature differences Thermoelectric
	Effects of the Ni electrodeposit on microstructure evolution and electrical resistance of the P-type Bi2Te3 solder joint 期刊论文 Journal of Alloys and Compounds, 2020, 卷号: 832 作者: Cheng, Jinxuan; Hu, Xiaowu; Li, Qinglin 收藏 \| 浏览/下载：22/0 \| 提交时间：2020/11/14 Bismuth compounds Diffusion Electric resistance Electrodes Growth rate IV-VI semiconductors Microstructure Scanning electron microscopy Tin Tin compounds Transmission electron microscopy Diffusion process Electrical resistances Micro-structure evolutions Porous structures Thermodynamically stable Thermoelectric Volume diffusion X ray diffractometers
	Effect of Power Ultrasound on Dissolution Behavior of Cu/Sn System 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 8, 页码: 2724-2729 作者: Yu, Weiyuan; Lei, Zhen; Sun, Xuemin; Wu, Baolei; Sun, Jungang 收藏 \| 浏览/下载：6/0 \| 提交时间：2020/11/14 Acoustic streaming Atoms Cavitation Copper Dissolution Liquids Solubility Tin Ultrasonics Cavitation bubble Dissolution behavior Dissolution rates Method of finite elements Saturated solubility Solid solubilities Solid-liquid interfaces Ultrasonic cavitation

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