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浏览/检索结果: 共3条，第1-3条 帮助 限定条件 专题：北京大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Initial thermal stress and strain effects on thermal mechanical stability of through silicon via 期刊论文 MICROELECTRONIC ENGINEERING, 2016 Sun, Yunna; Sun, Shi; Zhang, Yazhou; Luo, Jiangbo; Wang, Yan; Ding, Guifu; Jin, Yufeng 收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03 IC packaging and fabricating  Thermal load  Initial thermal stress and deformation  Thermal mechanical reliability  THROUGH-SILICON  FATIGUE  COPPER  TSV  VIAS   Statistical Analysis of Retention Behavior and Lifetime Prediction of HfO(x)-based RRAM 其他 2011-01-01 Zhang, Lijie; Huang, Ru; Hsu, Yen-Ya; Chen, Frederick T.; Lee, Heng-Yuan; Chen, Yu-Sheng; Chen, Wei-Su; Gu, Pei-Yi; Liu, Wen-Hsing; Wang, Shun-Min; Tsai, Chen-Han; Tsai, Ming-Jinn; Chen, Pang-Shiu 收藏  |  浏览/下载：2/0  |  提交时间：2015/11/13 lifetime  data retention  breakdown  RRAM  MECHANISM  POWER   Statistical analysis of retention behavior and lifetime prediction of HfOBxB-based RRAM 其他 2011-01-01 Zhang, Lijie; Huang, Ru; Hsu, Yen-Ya; Chen, Frederick T.; Lee, Heng-Yuan; Chen, Yu-Sheng; Chen, Wei-Su; Gu, Pei-Yi; Liu, Wen-Hsing; Wang, Shun-Min; Tsai, Chen-Han; Tsai, Ming-Jinn; Chen, Pang-Shiu 收藏  |  浏览/下载：5/0  |  提交时间：2015/11/13