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浏览/检索结果: 共4条，第1-4条 帮助 限定条件 内容类型：其他     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Fabrication and Traceable Quality Evaluation of Fine Pitch TSV with Self-integrated Micro Heater and Thermocouple 其他 2016-01-01 Guan, Yong; Zeng, Qinghua; Bian, Yuan; Zhong, Xiao; Chen, Jing; Ma, Shenglin; Zhu, Yunhui; Jin, Yufeng 收藏  |  浏览/下载：7/0  |  提交时间：2017/12/03 3D packaging  fine pitch TSV  micro heater  thermocouple  quality evaluation  THROUGH-SILICON VIAS  STACKING TECHNOLOGY  LINER   Mechanical and Electrical Reliability Assessment of Bump-less Wafer-on-Wafer Integration with One-time Bottom-up TSV Filling 其他 2015-01-01 Guan, Yong; Zhu, Yunhui; Zeng, Qinghua; Ma, Shenglin; Su, Fei; Bian, Yuan; Zhong, Xiao; Chen, Jing; Jin, Yufeng 收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03 INTERPOSER  STACKING   Temporary bonding/debonding based on propylene carbonate 其他 2015-01-01 Zhu, Zhiyuan; Du, Hong; Guan, Yong; Wang, Hao; Yu, Min; Jin, Yufeng; Zhang, Zhao 收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03 A Wafer Level Through-Stack-Via Integration Process with One-time Bottom-up Copper Filling 其他 2014-01-01 Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Fang, Runiu; Zhong, Xiao; Bian, Yuan; Guan, Yong; Chen, Jing; Miao, Min; Jin, Yufeng 收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03 INTERCONNECTS