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Iterative Global Similarity Points : A robust coarse-to-fine integration solution for pairwise 3D point cloud registration 其他
2018-01-01
作者:  Pan, Yue;  Yang, Bisheng;  Liang, Fuxun;  Dong, Zhen
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/05
Iterative Global Similarity Points : A robust coarse-to-fine integration solution for pairwise 3D point cloud registration 其他
2018-01-01
作者:  Pan, Yue;  Yang, Bisheng;  Liang, Fuxun;  Dong, Zhen
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/05
The 3D Terrain Interactive Technique Based on Gesture Recognition 其他
2016-01-01
Yanyan Li; Xiaomeng Xu; Jiayu Sun; Haimeng Zhao
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
Evaluation and Optimization of Thermo-Mechanical Reliability of a TSV-based 3D MEMS 其他
2016-01-01
Zeng, Qinghua; Guan, Yong; Chen, Jing; Meng, Wei; Jin, Yufeng
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Fabrication and Characterization of Fine Pitch TSV Integration with Self-aligned Backside Insulation Layer Opening 其他
2016-01-01
Guan, Yong; Zeng, Qinghua; Chen, Jing; Ma, Shenglin; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
A full chip scale numerical simulation method for thermal management of 3D IC 其他
2016-01-01
Wang, Ningyu; Jin, Yufeng; Pi, Yudan; Wang, Wei
收藏  |  浏览/下载：8/0  |  提交时间：2017/12/03
High Frequency Analysis and Characterization of TSVs for High-Speed Integrated Systems 其他
2016-01-01
Miao, Min; Fang, Runiu; Sun, Xin; Cui, Xiaole; Jin, Yufeng
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Enhanced Recrystallization of Ultra-Thin a-Silicon Film by 2-D Confined Lattice Regrowth 其他
2016-01-01
Zhang, Hao; Li, Ming; Chen, Gong; Yang, Yuancheng; Huang, Ru
收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03
Thermal-Mechanical Reliability Analysis of Connection Structure between Redistribution Layer and TSV for MEMS Packaging 其他
2016-01-01
Meng, Wei; Zeng, Qinghua; Guan, Yong; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Bias-dependent High Frequency Characterization of Through-Silicon Via (TSV) for 3D Integration 其他
2016-01-01
Sun, Xin; Fang, Runiu; Liu, Huan; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03

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