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浏览/检索结果: 共10条，第1-10条 帮助 限定条件 内容类型：会议     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging (CPCI-S收录) 会议 作者:  Huang, Jia-Qiang[1];  Zhou, Min-Bo[1];  Li, Wang-Yun[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 lead-free solder joint  interfacial reaction  microstructure  BGA  differential scanning calorimetry   Effect of the Au bonding pad contamination on the wettability of Au/Sn-3.0Ag-0.5Cu/Au solder joints in flux-free laser jet solder ball bondin (CPCI-S收录) 会议 作者:  Yue, Wu[1];  Zhou, Min-Bo[2,3];  Zhang, Xin-Ping[2,3] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 laser jet solder ball bonding  Sn-3.0Ag-0.5Cu solder ball  wettability  surface contamination   Creep deformation and fracture behavior of microscale Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo- mechanical coupled loads (CPCI-S收录) 会议 作者:  Li, Wang-Yun[1];  Cao, Shan-Shan[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 micro-scale solder joint  creep deformation  current density  electro-thermo-mechanical coupled loads   Size effect on creep deformation and fracture behavior of micro-scale Cu/Sn-3.0Ag-O.5Cu/Cu solder joints (CPCI-S收录) 会议 作者:  Li, Wang-Yun[1];  Cao, Shan-Shan[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 micro-scale solder joint  size effect  creep deformation  creep mechanism  fracture behavior   Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (CPCI-S收录) 会议 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Li, Wang-Yun[1,2];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：10/0  |  提交时间：2019/04/11 BGA solder joint  size effect  lead-free solder  interfacial reaction  microstructure   Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (CPCI-S收录) 会议 作者:  Huang, Lia-Qiang[1,2];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 Sn58Bi  Sn3.0Ag0.5Cu  Mixed solder joint  Microstructure  interfacial reaction  Ball grid array   Influence of the solder volume and reflow process on solderability of the aluminum solder paste and reliability of Sn-0.3Ag-0.7Cu/6061Al sold (CPCI-S收录) 会议 作者:  Lin, Yuan-Jiang[1];  Zhou, Min-Bo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 Aluminum solder paste  reflow process  soldering parameter  reliability   Essential factors influencing the wettability of Sn-3.0Ag-0.5Cu solder balls on Au pad of the right-angle solder interconnect in laser jet so (CPCI-S收录) 会议 作者:  Yue, Wu[1];  Zhang, Xin-Ping[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 laser jet solder ball bonding  Sn-3.0Ag-0.5Cu solder ball  wettability  surface oxidation layer   Creep behavior of Cu/Sn-3.0Ag-0.5Cu/Cu solder joints under tensile stress coupled with DC current stressing (CPCI-S收录) 会议 作者:  Li, Wang-Yun[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/11 Cu/Sn-3.0Ag-0.5Cu/Cu solder joint  creep behavior  DC current stressing  fracture mode  joint thickness   Quasi in-situ study of morphological evolution of the interfacial IMC in single-sided interface Sn-0.3Ag-0.7Cu/Cu joints during multiple refl (CPCI-S收录) 会议 作者:  Zhou, Min-Bo[1];  Jin, Hong[1];  Ke, Chang-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：10/0  |  提交时间：2019/04/11 morphological evolution  intermetallic compounds  lead-free solder joint  multiple reflow  quasi in-situ method