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浏览/检索结果: 共13条，第1-10条 帮助 限定条件 内容类型：会议     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging (CPCI-S收录) 会议 作者:  Huang, Jia-Qiang[1];  Zhou, Min-Bo[1];  Li, Wang-Yun[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 lead-free solder joint  interfacial reaction  microstructure  BGA  differential scanning calorimetry   Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (EI收录) 会议 Wuhan, China, 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/11 Ball grid arrays  Electronics packaging  Intermetallics  Isotherms  Lead  free solders  Microstructural evolution  Microstructure  Packaging materials  Soldered joints  Soldering  Soldering alloys  Surface chemistry  Thermal expansion   Effect of autoclave cure cycles on the interfacial properties of composite laminates (EI收录) 会议 Munich, Germany, 作者:  Zhan, Lihua[1,2];  Tan, Wei[1,2,3];  Chang, Tengfei[1,4];  Ding, Xingxing[1,2] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 Autoclaves  Bonding  Carbon  Carbon fibers  Characterization  Composite materials  Curing  Manufacture  Pressure vessels  Shear strength  Steam turbines  Structure (composition)   Numerical Analysis of Interface Debonding Detection in bonded repair with Rayleigh Waves (CPCI-S收录) 会议 作者:  Xu, Ying[1];  Li, BingCheng[1];  Lu, Miaomiao[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 Rayleigh Wave  Interfacial Debonding  FRP  Dispersion Curves  Finite Element Method   Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (EI收录) 会议 Wuhan, China, 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Li, Wang-Yun[1,2];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Ball grid arrays  Electronics packaging  Flip chip devices  Isotherms  Lead  free solders  Microstructural evolution  Microstructure  Size determination  Soldered joints  Soldering  Soldering alloys  Surface chemistry   Influence of the zinc-oxide/salt content in the aluminum soldering flux on interfacial microstructure and mechanical property of Sn-0.7Cu/Al (CPCI-S收录) 会议 作者:  Chen, Guo-Liang[1,2];  Zhou, Min-Bo[1,2];  Zhang, Lang[1,2];  Lin, Yuan-Jiang[1,2];  Zhang, Yu-Peng[3] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/11 aluminum soldering  Sn-0.7Cu solder  interfacial microstructure  mechanical property  LED assembly   Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (CPCI-S收录) 会议 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Li, Wang-Yun[1,2];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：10/0  |  提交时间：2019/04/11 BGA solder joint  size effect  lead-free solder  interfacial reaction  microstructure   Interfacial reaction and IMC growth between the undercooled liquid lead-free solder and Cu metallization (CPCI-S收录) 会议 作者:  Zhou, Min-Bo[1,2];  Feng, Jian-Qiang[1,2];  Yue, Wu[3];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/11 interfacial reaction  intermetallic compound  undercooling dwelling  low temperature soldering   Numerical Studies of Interface Debonding Damage Detection in FRP Strengthened Steel Beam Using Rayleigh Waves (CPCI-S收录) 会议 作者:  Xu, Ying[1];  Li, Bingcheng[1];  Gong, Xiaojie[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 interfacial debonding damage  rayleigh wave  FRP  dispersion curves  finite element method   Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (CPCI-S收录) 会议 作者:  Huang, Lia-Qiang[1,2];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 Sn58Bi  Sn3.0Ag0.5Cu  Mixed solder joint  Microstructure  interfacial reaction  Ball grid array