×
验证码:
换一张
忘记密码?
记住我
CORC
首页
科研机构
检索
知识图谱
申请加入
托管服务
登录
注册
在结果中检索
科研机构
华南理工大学 [8]
内容类型
会议 [8]
×
知识图谱
CORC
开始提交
已提交作品
待认领作品
已认领作品
未提交全文
收藏管理
QQ客服
官方微博
反馈留言
浏览/检索结果:
共8条,第1-8条
帮助
限定条件
内容类型:会议
已选(
0
)
清除
条数/页:
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
排序方式:
请选择
作者升序
作者降序
题名升序
题名降序
发表日期升序
发表日期降序
提交时间升序
提交时间降序
Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging (CPCI-S收录)
会议
作者:
Huang, Jia-Qiang[1]
;
Zhou, Min-Bo[1]
;
Li, Wang-Yun[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
lead-free solder joint
interfacial reaction
microstructure
BGA
differential scanning calorimetry
Research on thermal-electric coupling effect of the Copper Pillar Bump in the Flip Chip Packaging (CPCI-S收录)
会议
作者:
Fu Zhiwei[1,2]
;
Zhou Bin[1,2]
;
Yao Ruohe[1]
;
Li Xunping[2]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
Copper pillar bumps
thermal-electric coupling
Joule heat effcet
current density
Research on thermal-electric coupling effect of the copper pillar bump in the flip chip packaging (EI收录)
会议
Wuhan, China,
作者:
Fu, Zhiwei[1,2]
;
Zhou, Bin[1,2]
;
Yao, Ruohe[1]
;
Li, Xunping[2]
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2019/04/11
Copper
Current density
Electronics packaging
Joule heating
Packaging
Stress concentration
Temperature distribution
Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (EI收录)
会议
Wuhan, China,
作者:
Huang, Jia-Qiang[1,2]
;
Zhou, Min-Bo[1]
;
Li, Wang-Yun[1,2]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
Ball grid arrays
Electronics packaging
Flip chip devices
Isotherms
Lead
free solders
Microstructural evolution
Microstructure
Size determination
Soldered joints
Soldering
Soldering alloys
Surface chemistry
Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (CPCI-S收录)
会议
作者:
Huang, Jia-Qiang[1,2]
;
Zhou, Min-Bo[1]
;
Li, Wang-Yun[1,2]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2019/04/11
BGA solder joint
size effect
lead-free solder
interfacial reaction
microstructure
Reliability analysis and case studies on FCBGA packaged devices (EI收录)
会议
Changsha, China,
作者:
Lin, Xiao-Ling[1]
;
Xie, Shao-Feng[1]
;
Yao, Ruo-He[2]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
Chip scale packages
Cracks
Electronics packaging
Failure (mechanical)
Failure analysis
Field programmable gate arrays (FPGA)
Flip chip devices
Integrated circuit interconnects
Packaging
Reconfigurable hardware
Reliability
Soldered joints
Soldering
Soldering alloys
Thermal stress
Reliability Analysis and Case Studies on FCBGA Packaged Devices (CPCI-S收录)
会议
作者:
Lin, Xiao-ling[1]
;
Xie, Shao-feng[1]
;
Yao, Ruo-he[2]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
Flip chip plastic ball grid array (FC-PBGA)
thermal stress
reflowing
reliability analysis
Size and geometry effects on the electromigration behaviour of flip-chip Sn3.5Ag solder joints (CPCI-S收录)
会议
作者:
Qin, Hong-bo[1,2]
;
Yue, Wu[1,3]
;
Zhang, Xin-Ping[1]
;
Yang, Dao-guo[2]
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2019/04/11
electromigration
solder joint
size and geometry effects
current density
finite element analysis
©版权所有 ©2017 CSpace - Powered by
CSpace