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| Nano-Twisted Double Helix Carbon Debris Improves the Wear Resistance of Ultra-Thick Diamond-Like Carbon Coatings 会议论文
作者: Sui, Xudong; Wang, Xinyu; Zhang, Shuaituo; Yan, Mingming; Li, Wensheng
  收藏 | 浏览/下载：26/0 | 提交时间：2020/12/18
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| An Introduction to Biomimetic Underwater Adhesion System 会议论文
Changsa, China, July 4-8, 2018
作者: Liu LQ(刘连庆) ; Tan WJ(谭文君); Zhang C(张闯)
收藏 | 浏览/下载：23/0 | 提交时间：2019/03/30 |
| Interface tailoring for charge injection mitigation in insulators: Different principles and achievements 会议论文
作者: Teyssedre, G.; Li, S.T.; Makasheva, K.; Zhao, N.; Laurent, C.
收藏 | 浏览/下载：2/0 | 提交时间：2019/11/19
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| Preparation and Thermal Analysis of the nano-silver/Graphene composite material for packaging module 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者: Liu, Dongjing[1]; Fan, Yasong[2]; Yan, Haidong[3]; Lin, Haiying[4]; Zhu, Haidong[5]
收藏 | 浏览/下载：13/0 | 提交时间：2019/12/24
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| Probing bio-nano interactions with colloidal poly(ethylene glycol) particles 会议论文
256th National Meeting and Exposition of the American-Chemical-Society (ACS) - Nanoscience, Nanotechnology and Beyond, AUG 19-23, 2018
作者: Cui, Jiwei
收藏 | 浏览/下载：3/0 | 提交时间：2019/12/31 |
| An Introduction to Biomimetic Underwater Adhesion System 会议论文
Changsa, China, July 4-8, 2018
作者: Tan WJ(谭文君); Zhang C(张闯); Liu LQ(刘连庆)
收藏 | 浏览/下载：9/0 | 提交时间：2019/03/30 |
| Surface modification of nano-size SiO2 filler for flip chip underfill applications 会议论文
Harbin
作者: Gang Li; yachuan He; Pengli Zhu; Tao Zhao; Rong Sun
收藏 | 浏览/下载：36/0 | 提交时间：2018/02/02 |
| Pyrrolidone diblock copolymers nano-objects: From bulk to interface 会议论文
作者: Dong, Jinfeng
收藏 | 浏览/下载：1/0 | 提交时间：2019/12/05 |
| Insights into the role of interface in the rheological property of underfill composites 会议论文
China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China
作者: Qian Guo; Pengli Zhu; Junjie Wen; Gang Li; Tianyu Wang
收藏 | 浏览/下载：15/0 | 提交时间：2017/01/15 |
| Numerical Investigation on Atomic Migration Effect on Thermal Conductivity of Al/Cu Interface Structures in Electronic Interconnection Packaging 会议论文
7th International Symposium on Dielectrics for Nanosystems - Materials Science, Processing, Reliability and Manufacturing held as part of the 229th Meeting of The Electrochemical-Society, 2016-05-29
作者: Zhang, L. Q.[1]; Ge, D. H.[2]
收藏 | 浏览/下载：4/0 | 提交时间：2019/12/24 |
