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	Insights into the role of interface in the rheological property of underfill composites
	Qian Guo; Pengli Zhu; Junjie Wen; Gang Li; Tianyu Wang; Ali Li; Daoqiang Daniel Lu; Rong Sun; Chingping Wong
	2016
会议名称	China Semiconductor Technology International Conference 2016, CSTIC 2016
会议地点	Shanghai, China
英文摘要	With the use of nano-sized silica particles as fillers, the rheological property of the underfill composites is greatly deteriorated, due to the excessive surface energy of the nano-sized fillers and their poor interfacial compatibility with the underfill matrix. Since interface property is one of the dominant factors for determining the properties of composites, in this study, four kinds of silica nanoparticles with different surface chemistry were used to comparatively study the role of interface in the rheological property of amine-cured epoxy underfill composites. And it is found that the fillers with surface functional groups, which have reactivity or good compatibility with the underfill base materials, could not only drastically decrease the viscosity, but also largely improve the viscosity stability of the underfill composites.
收录类别	EI
语种	英语
内容类型	会议论文
源URL	[http://ir.siat.ac.cn:8080/handle/172644/10096]
专题	深圳先进技术研究院_集成所
作者单位	2016
推荐引用方式 GB/T 7714	Qian Guo,Pengli Zhu,Junjie Wen,et al. Insights into the role of interface in the rheological property of underfill composites[C]. 见:China Semiconductor Technology International Conference 2016, CSTIC 2016. Shanghai, China.

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