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浏览/检索结果: 共4条，第1-4条 帮助 限定条件 内容类型：会议论文    专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Volume effect on interfacial microstructure and mechanical properties of Ni(UBM)/Sn3.0Ag0.5Cu/Ni(UBM) joints (CPCI-S收录EI收录) 会议论文 14th International Conference on Electronic Materials and Packaging, EMAP 2012, Lantau Island, Hong kong, December 13, 2012 - December 16, 2012 作者:  Zeng, Jing-Bo[1];  Xu, Guang-Sui[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：7/0  |  提交时间：2019/04/15 Brittle fracture  Brittleness  Failure modes  Morphology  Nickel  Tensile strength   Influence of Mixed Rare Earth Addition on the Microstructure of the Sn-Cu-Ni Solder and Interfacial Reaction of Cu/Sn-Cu-Ni/Cu Joints (CPCI-S收录) 会议论文 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP) 作者:  Li Wei[1];  Zhou Min-Bo[1];  Ma Xiao[1];  Zhang Xin-Ping[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 Influence of mixed rare earth addition on the microstructure of the Sn-Cu-Ni solder and interfacial reaction of Cu/Sn-Cu-Ni/Cu joints (EI收录) 会议论文 ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, August 8, 2011 - August 11, 2011 作者:  Li, Wei[1];  Zhou, Min-Bo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/15 Cerium  Copper alloys  Electronics packaging  Intermetallics  Lanthanum  Microstructure  Packaging  Rare earth additions  Rare earths  Soldering alloys  Tin alloys   Current induced interfacial microstructure and strength weakening of SAC/FeNi-Cu connection (EI收录) 会议论文 Applied Mechanics and Materials, Huhhot, China, July 26, 2014 - July 27, 2014 作者:  Wang, Xiao Jing[1];  Li, Tian Yang[1];  Chen, Yun Xia[2];  Wang, Jian Xin[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/12 Ductile fracture  Electrodes  Electromigration  Grain boundaries  Intermetallics  Lead  free solders  Microstructure  Shear flow