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Investigation on critical crack-free cutting depth for single crystal silicon slicing with fixed abrasive wire saw based on the scratching machining experiments 期刊论文
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2018, 卷号: 74, 页码: 261-266
作者:  Ge, Mengran;  Zhu, Hongtao;  Huang, Chuanzhen;  Liu, Ao;  Bi, Wenbo
收藏  |  浏览/下载:16/0  |  提交时间:2019/12/11
Higher order zero time discontinuity mapping for analysis of degenerate grazing bifurcations of impacting oscillators 期刊论文
JOURNAL OF SOUND AND VIBRATION, 2018, 卷号: Vol.437, 页码: 209-222
作者:  Yin, Shan;  Wen, Guilin;  Xu, Huidong;  Wu, Xin
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/26


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