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内嵌扰流式微通道TSV转接板关键工艺及其特性研究 学位论文
2016, 2016
夏雁鸣
收藏  |  浏览/下载:5/0  |  提交时间:2017/06/20
Effect of Remelting Duration on Microstructure and Properties of SiCp/Al Composite Fabricated by Powder-Thixoforming for Electronic Packaging 期刊论文
METALS, 2016, 卷号: 6, 期号: 12
作者:  Cai, Siyu;  Chen, Tijun;  Zhang, Xuezheng
收藏  |  浏览/下载:3/0  |  提交时间:2019/11/15
基于F800重量配料控制器的物料数据采集传输装置 专利
专利类型: 实用新型, 专利号: CN205693792U, 申请日期: 2016-11-16, 公开日期: 2016-11-16
作者:  黄剑龙;  王忠锋;  李力刚;  王福东;  徐石明
收藏  |  浏览/下载:23/0  |  提交时间:2016/12/23
Explore of warpage origination in wlp and processing influence factors by experiment and theoretical modeling 期刊论文
Journal of materials science-materials in electronics, 2016, 卷号: 27, 期号: 11, 页码: 11548-11555
作者:  Li, Heng;  Cheng, Gong;  Xu, Gaowei;  Luo, Le
收藏  |  浏览/下载:17/0  |  提交时间:2019/05/09
Cellulose-based films prepared directly from waste newspapers via an ionic liquid 期刊论文
CARBOHYDRATE POLYMERS, 2016, 卷号: 151, 页码: 223-229
作者:  Xia, Guangmei;  Wan, Jiqiang;  Zhang, Jinming;  Zhang, Xiaoyu;  Xu, Lili
收藏  |  浏览/下载:15/0  |  提交时间:2016/12/29
Controllable large scaled nanotwin formation in cu film at lower temperatures 期刊论文
Journal of physics d-applied physics, 2016, 卷号: 49, 期号: 40, 页码: 8
作者:  Cheng, Gong;  Li, Heng;  Zhang, Weibo;  Xu, Gaowei;  Luo, Le
收藏  |  浏览/下载:34/0  |  提交时间:2019/05/09
姚明织带新兴市场的营销策略研究 学位论文
2016, 2016
胡幸
收藏  |  浏览/下载:2/0  |  提交时间:2017/06/20
Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode 会议论文
17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16
作者:  Nie, Zhiqiang;  Wu, Di;  Lu, Yao;  Wu, Dhai;  Wang, Shuna
收藏  |  浏览/下载:85/0  |  提交时间:2016/11/22
A compact QCW conduction-cooled high power semiconductor laser array 会议论文
17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16
作者:  Zhu, Qiwen;  Zhang, Pu;  Wang, Shuna;  Wu, Dihai;  Nie, Zhiqiang
收藏  |  浏览/下载:27/0  |  提交时间:2016/11/22
Thermal behavior of microchannel cooled high power diode laser arrays 会议论文
17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei
收藏  |  浏览/下载:31/0  |  提交时间:2016/11/22


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