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浏览/检索结果: 共8条，第1-8条 帮助 限定条件 发表日期：2016     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 High accuracy three-dimensional attitude angle measuring device 期刊论文 guangxue jingmi gongcheng/optics and precision engineering, 2016, 卷号: 24, 期号: 5, 页码: 963-970 作者:  Sun, Guo-Yan;  Gao, Li-Min;  Bai, Jian-Ming;  Yang, Dong-Lai;  Pan, Liang 收藏  |  浏览/下载：20/0  |  提交时间：2016/10/13 Angle measurement  Calibration  CMOS integrated circuits  Field programmable gate arrays (FPGA)  Optical systems  Precision engineering  Transfer matrix method   Highly thermally conductive polymer nanocomposites based on boron nitride nanosheets decorated with silver nanoparticles 期刊论文 RSC ADVANCES, 2016 作者:  Wang, Fangfang;  Yao, Yimin;  Zeng, Xiaoliang;  Huang, Tao;  Sun, Rong 收藏  |  浏览/下载：15/0  |  提交时间：2017/01/13 Performance projections for ballistic carbon nanotube FinFET at circuit level 期刊论文 NANO RESEARCH, 2016 Zhang, Panpan; Qiu, Chenguang; Zhang, Zhiyong; Ding, Li; Chen, Bingyan; Peng, Lianmao 收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03 carbon nanotube  fin field-effect transistor (FinFET)  integrated circuits  multi-threshold voltage  FIELD-EFFECT TRANSISTORS  INTEGRATED-CIRCUITS  ON/OFF RATIO  LOGIC GATES  DEVICES  DIELECTRICS  MODEL   Fine-pitch through-silicon via integration with self-aligned back-side benzocyclobutene passivation layer 期刊论文 MICRO & NANO LETTERS, 2016 Guan, Yong; Ma, Shenglin; Zeng, Qinghua; Chen, Jing; Jin, Yufeng 收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03 three-dimensional integrated circuits  passivation  organic compounds  sputter etching  chemical mechanical polishing  radiography  optical microscopy  scanning electron microscopy  vector network analyser  four probe electrical measurement  scanning electron microscopy  optical microscopy  X-ray radiographic testing  repeatability  chemical mechanical polishing  plasma etching  back side benzocyclobutene passivation layer  self aligned benzocyclobutene passivation layer  fine pitch thr   Simple and accurate inductance model of 3D inductor based on TSV 期刊论文 2016, 卷号: 52, 页码: 1815-1816 作者:  Wang, Fengjuan;  Yu, Ningmei 收藏  |  浏览/下载：10/0  |  提交时间：2019/12/20 three-dimensional integrated circuits  inductors  solenoids  finite element analysis  integrated circuit modelling  on-chip inductors  integrated circuit application  through-silicon via  TSV  3D inductor  solenoid architecture  finite element method   Characteristics of coaxial-annular through-silicon-via in microwave field 会议论文 2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2016-01-01 作者:  Wang, Fengjuan;  Wang, Gang;  Yu, Ningmei 收藏  |  浏览/下载：6/0  |  提交时间：2019/12/20 Reflection coefficient  insertion loss  coaxial-annular through-silicon-via  three-dimensional integrated circuits   Simulation and evaluation of thermal mechanical reliability of 3D-TSV stack with viscoelastic underfill 会议论文 Proceedings of the Electronic Packaging Technology Conference, EPTC, 2015-12-02 作者:  Zeng, Q.;  Guan, Y.;  Su, F.;  Chen, J.;  Jin, Y. 收藏  |  浏览/下载：7/0  |  提交时间：2019/12/30 Chip scale packages  Electronics packaging  Finite element method  Reliability  Thermal cycling  Viscoelasticity  Chip deformations  Relaxation modulus  Silicon interposers  Temperature dependent  Thermal-mechanical reliability  Time dependent  Viscoelastic properties  Williams-Landel-Ferry equations  Three dimensional integrated circuits   Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration 会议论文 18th IEEE Electronics Packaging Technology Conference (EPTC), Singapore, SINGAPORE, 2016-11-30 作者:  Liu, Huan;  Zeng, Qinghua;  Guan, Yong;  Fang, Runiu;  Sun, Xin 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/30 Chip scale packages  Electronics packaging  Failure (mechanical)  Fatigue of materials  Finite element method  Shear stress  Soldering  Stresses  Thermal load  Timing circuits  Global simulation  Interfacial failures  Load condition  Maximum principal stress  Resistance measurement  Solder balls  Thermal mechanical stress  Thermal-mechanical reliability  Three dimensional integrated circuits