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	Design of a novel 5-DOF flexure-based compound alignment stage for Roll-to-Roll Printed Electronics
	Chen, Weihai; Yang, Shang; Liu, Jingmeng; Chen, Wenjie; Jin, Yan
刊名	REVIEW OF SCIENTIFIC INSTRUMENTS
	2017
卷号	88页码:025002
ISSN号	0034-6748
DOI	10.1063/1.4974814
URL标识	查看原文
收录类别	SCIE ; EI ; PUBMED
WOS记录号	WOS:000395902700053
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/5942265
专题	北京航空航天大学
推荐引用方式 GB/T 7714	Chen, Weihai,Yang, Shang,Liu, Jingmeng,et al. Design of a novel 5-DOF flexure-based compound alignment stage for Roll-to-Roll Printed Electronics[J]. REVIEW OF SCIENTIFIC INSTRUMENTS,2017,88:025002.
APA	Chen, Weihai,Yang, Shang,Liu, Jingmeng,Chen, Wenjie,&Jin, Yan.(2017).Design of a novel 5-DOF flexure-based compound alignment stage for Roll-to-Roll Printed Electronics.REVIEW OF SCIENTIFIC INSTRUMENTS,88,025002.
MLA	Chen, Weihai,et al."Design of a novel 5-DOF flexure-based compound alignment stage for Roll-to-Roll Printed Electronics".REVIEW OF SCIENTIFIC INSTRUMENTS 88(2017):025002.

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