Intermetallic compounds evolution between lead-free solder and cu-based lead frame alloys during isothermal aging

	Intermetallic compounds evolution between lead-free solder and cu-based lead frame alloys during isothermal aging
	Xia, YH ; Xie, XM ; Xie, XM ; Lu, CY
刊名	JOURNAL OF MATERIALS SCIENCE
	2006
卷号	41 期号:8 页码:2359-2364
关键词	FLIP-CHIP TECHNOLOGY INTERFACIAL MICROSTRUCTURE SNAGCU SOLDER TIN-LEAD GROWTH JOINTS COPPER
ISSN号	0022-2461
通讯作者	Xia, YH, Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, Shanghai 200050, Peoples R China
学科主题	Materials Science, Multidisciplinary
收录类别	SCI
语种	英语
公开日期	2012-03-24
内容类型	期刊论文
源URL	[http://ir.sim.ac.cn/handle/331004/95202]
专题	上海微系统与信息技术研究所_功能材料与器件_期刊论文
推荐引用方式 GB/T 7714	Xia, YH,Xie, XM,Xie, XM,et al. Intermetallic compounds evolution between lead-free solder and cu-based lead frame alloys during isothermal aging[J]. JOURNAL OF MATERIALS SCIENCE,2006,41(8):2359-2364.
APA	Xia, YH,Xie, XM,Xie, XM,&Lu, CY.(2006).Intermetallic compounds evolution between lead-free solder and cu-based lead frame alloys during isothermal aging.JOURNAL OF MATERIALS SCIENCE,41(8),2359-2364.
MLA	Xia, YH,et al."Intermetallic compounds evolution between lead-free solder and cu-based lead frame alloys during isothermal aging".JOURNAL OF MATERIALS SCIENCE 41.8(2006):2359-2364.