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	Convective heat transfer enhancement by novel honeycomb-core in sandwich panel exchanger fabricated by additive manufacturing
	Kong, Dekui; Zhang, Yongcun; Liu, Shutian
刊名	Applied Thermal Engineering
	2019
卷号	163
ISSN号	13594311
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3226423
专题	大连理工大学
作者单位	State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Dalian, 116024, China
推荐引用方式 GB/T 7714	Kong, Dekui,Zhang, Yongcun,Liu, Shutian. Convective heat transfer enhancement by novel honeycomb-core in sandwich panel exchanger fabricated by additive manufacturing[J]. Applied Thermal Engineering,2019,163.
APA	Kong, Dekui,Zhang, Yongcun,&Liu, Shutian.(2019).Convective heat transfer enhancement by novel honeycomb-core in sandwich panel exchanger fabricated by additive manufacturing.Applied Thermal Engineering,163.
MLA	Kong, Dekui,et al."Convective heat transfer enhancement by novel honeycomb-core in sandwich panel exchanger fabricated by additive manufacturing".Applied Thermal Engineering 163(2019).

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