Convective heat transfer enhancement by novel honeycomb-core in sandwich panel exchanger fabricated by additive manufacturing | |
Kong, Dekui; Zhang, Yongcun; Liu, Shutian | |
刊名 | Applied Thermal Engineering |
2019 | |
卷号 | 163 |
ISSN号 | 13594311 |
URL标识 | 查看原文 |
WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/3226423 |
专题 | 大连理工大学 |
作者单位 | State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Dalian, 116024, China |
推荐引用方式 GB/T 7714 | Kong, Dekui,Zhang, Yongcun,Liu, Shutian. Convective heat transfer enhancement by novel honeycomb-core in sandwich panel exchanger fabricated by additive manufacturing[J]. Applied Thermal Engineering,2019,163. |
APA | Kong, Dekui,Zhang, Yongcun,&Liu, Shutian.(2019).Convective heat transfer enhancement by novel honeycomb-core in sandwich panel exchanger fabricated by additive manufacturing.Applied Thermal Engineering,163. |
MLA | Kong, Dekui,et al."Convective heat transfer enhancement by novel honeycomb-core in sandwich panel exchanger fabricated by additive manufacturing".Applied Thermal Engineering 163(2019). |
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