High-Temperature Active Soldering of SiC Particle-Reinforced Al-MMC Using a Novel ZnAlGaMgTi Filler Metal | |
Chen, Biqiang; Zhang, Guifeng; Zhang, Linjie; Xu, Tingting | |
刊名 | JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE |
2017 | |
卷号 | 26页码:5137-5145 |
关键词 | aluminum matrix composites intergranular penetration and spreading active soldering runout |
ISSN号 | 1059-9495 |
URL标识 | 查看原文 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/2941487 |
专题 | 西安交通大学 |
推荐引用方式 GB/T 7714 | Chen, Biqiang,Zhang, Guifeng,Zhang, Linjie,et al. High-Temperature Active Soldering of SiC Particle-Reinforced Al-MMC Using a Novel ZnAlGaMgTi Filler Metal[J]. JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE,2017,26:5137-5145. |
APA | Chen, Biqiang,Zhang, Guifeng,Zhang, Linjie,&Xu, Tingting.(2017).High-Temperature Active Soldering of SiC Particle-Reinforced Al-MMC Using a Novel ZnAlGaMgTi Filler Metal.JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE,26,5137-5145. |
MLA | Chen, Biqiang,et al."High-Temperature Active Soldering of SiC Particle-Reinforced Al-MMC Using a Novel ZnAlGaMgTi Filler Metal".JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE 26(2017):5137-5145. |
个性服务 |
查看访问统计 |
相关权益政策 |
暂无数据 |
收藏/分享 |
除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。
修改评论