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Creep behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo-mechanical coupled loads (CPCI-S收录) 会议
作者:  Li, W. Y.[1];  Jin, H.[1];  Yue, W.[2];  Tan, M. Y.[1];  Zhang, X. P.[1]
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/11
Numerical simulation of the emergency brake process in granular material transportation using DEM: Effect of the liquid bridge (EI收录) 会议
Beijing, China,
作者:  Ke, Chunhai[1];  Zhang, Hao[1,2,3];  Yue, Xiaoqiang[1];  Feng, Chunsheng[1];  Shu, Shi[1]
收藏  |  浏览/下载:3/0  |  提交时间:2019/04/11


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