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| Patterns of somatic mutations in hepatitis B virus-associated hepatocellular carcinomas 会议论文
中华医学会第五次全国病毒性肝炎慢性化、重症化基础与临床研究进展学术会议, 重庆, 2015-05-07
作者: Pan Q(潘琦); Wenwei Yin; Shiwen Tong; Dewei Li; Xiaoyuan Li
  收藏 | 浏览/下载：8/0 | 提交时间：2020/01/13 |
| Genetic analysis in a patient with nine primary malignant neoplasms: A rare case of Li-Fraumeni syndrome 会议论文
CANCER RESEARCH, 2014-10-01
作者: Li, Xiaoyuan; Kang, Juan; Pan, Qi; Yin, Wenwei; Tong, Shiwen
收藏 | 浏览/下载：3/0 | 提交时间：2020/01/13 |
| A monoclinic-tetragonal ferroelectric phase transition in lead-free (K0.5Na0.5)NbO3-x%LiNbO3solid solution 会议论文
作者: Ge, Wenwei; Ren, Yang; Zhang, Jialiang; Devreugd, Christopher P.; Li, Jiefang
收藏 | 浏览/下载：2/0 | 提交时间：2019/12/31 |
| Study on a mixed verification strategy for IP-based SoC design 会议论文
2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05, 2005-06-27
作者: Chen, Wenwei[1]; Zhang, Jinyi[2]; Li, Jiao[3]; Ren, Xiaojun[4]; Liu, Jiwei[5]
收藏 | 浏览/下载：5/0 | 提交时间：2019/05/10 |
| Study on a mixed verification strategy for IP-based SoC design 会议论文
Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05)
作者: Chen Wenwei[1]; Zhang Jinyi[2]; Li Jiao[3]; Ren Xiaojun[4]; Liu Jiwei[5]
收藏 | 浏览/下载：3/0 | 提交时间：2019/05/10
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| Study on a mixed verification strategy for IP-based SoC design 会议论文
Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05)
作者: Chen Wenwei[1]; Zhang Jinyi[2]; Li Jiao[3]; Ren Xiaojun[4]; Liu Jiwei[5]
收藏 | 浏览/下载：3/0 | 提交时间：2019/05/10
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| Study on a mixed verification strategy for IP-based SoC design 会议论文
Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05)
作者: Chen Wenwei[1]; Zhang Jinyi[2]; Li Jiao[3]; Ren Xiaojun[4]; Liu Jiwei[5]
收藏 | 浏览/下载：3/0 | 提交时间：2019/05/10
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| Study on a mixed verification strategy for IP-based SoC design 会议论文
Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05)
作者: Chen Wenwei[1]; Zhang Jinyi[2]; Li Jiao[3]; Ren Xiaojun[4]; Liu Jiwei[5]
收藏 | 浏览/下载：10/0 | 提交时间：2019/05/10
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