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Study on the Alkali Release from the Combustion Products of a Single Coal Particle by Laser Ignition (CPCI-S收录) 会议
作者:  Li, Shishi[1,2];  Dong, Meirong[1,2];  Lu, Jidong[1,2];  Tian, Zhaohua[1,2];  Hou, Zixin[1]
收藏  |  浏览/下载:7/0  |  提交时间:2019/04/11
Saliency detection optimization via modified secondary manifold ranking and blurring depression (EI收录) 会议
Sapporo, Hakodate, And Muroran, Hokkaido, Japan,
作者:  Liu, Han[1];  Li, Bo[1];  Gao, Hang[1]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/11
EMR: Extended manifold ranking for saliency detection (EI收录) 会议
Sapporo, Hakodate, And Muroran, Hokkaido, Japan,
作者:  Li, Bo[1];  Gao, Hang[1];  Liu, Han[1]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/11
A novel spatial information model for saliency detection (EI收录) 会议
Sapporo, Hakodate, And Muroran, Hokkaido, Japan,
作者:  Gao, Hang[1];  Li, Bo[1];  Liu, Han[1]
收藏  |  浏览/下载:3/0  |  提交时间:2019/04/11
The Effect of Mild Hypothermia on Neurons Autophagy after Cerebral Ischemia Reperfusion in Sirt1 Knockout Mice (CPCI-S收录) 会议
作者:  Wei, Hongyan[1];  Hu, Chunlin[1];  Li, Hengjie[2];  Yang, Yan[1];  Lu, Yuanzheng[1]
收藏  |  浏览/下载:9/0  |  提交时间:2019/04/11
MALBACsim: A Multiple Annealing and Looping Based Amplification Cycles simulator (EI收录) 会议
Washington, DC, United states,
作者:  Li, Tengpeng[1];  Zhang, Changsheng[1];  Xu, Bo[1];  Cai, Hongmin[1];  Li, Fuqiang[2]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/11
Experimental study on effect of primary air volume on wall erosion of a cold circulating fluidized bed (EI收录) 会议
Beijing, China,
作者:  Sun, Chaofan[1];  Peng, Zehong[1,2];  Deng, Jianhua[1];  Li, Debo[1];  Lou, Bo[2]
收藏  |  浏览/下载:4/0  |  提交时间:2019/04/11
Multi-tenancy authorization models for collaborative cloud services (CPCI-S收录) 会议
作者:  Tang, Bo[1,2];  Sandhu, Ravi[1,2];  Li, Qi[1,3]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/11
Research on Improvement of TiAlN Coating on Tribological properties of Miniature Inner Grooved Copper Tubes Drawing Mold Materials (CPCI-S收录) 会议
作者:  Ma, Bo[1];  Liu, Bin[1];  Yuan, Wei[1];  Li, Zongtao[1];  Li, Fuqiu[2]
收藏  |  浏览/下载:4/0  |  提交时间:2019/04/11
Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging (CPCI-S收录) 会议
作者:  Huang, Jia-Qiang[1];  Zhou, Min-Bo[1];  Li, Wang-Yun[1];  Zhang, Xin-Ping[1]
收藏  |  浏览/下载:3/0  |  提交时间:2019/04/11


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