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浏览/检索结果: 共6条，第1-6条 帮助 限定条件 内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序提交时间升序提交时间降序题名升序题名降序作者升序作者降序 Impact of the uncertainty of velocity information on rear-end collision in V2V communication environment 会议论文 4th International Conference on Intelligent Transportation Engineering, ICITE 2019, Singapore, Singapore, 2019-09-05 作者:  Zhang, Han;  Zhou, Bin;  Zhang, Junjie;  Liu, Miaomiao 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/30 Research of College English Independent Writing Teaching Model Based on Pigaiwang 会议论文 2nd International Conference on Information Technology and Industrial Automation (ICITIA), JUN 24-25, 2017 作者:  Han, Su;  Feng, Miaomiao;  Ma, Rongzi 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/31 How to use blogs in college English teaching 会议论文 2012 IEEE Symposium on Electrical and Electronics Engineering, EEESYM 2012, June 24, 2012 - June 27, 2012 作者:  Han, Su;  Feng, Miaomiao 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/31 On college English teaching of writing in the network environment 会议论文 作者:  Han, Su;  Feng, Miaomiao 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/31 Research on reliability of board level package-on-package in drop test (EI收录) 会议论文 Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, Xi'an, China, August 16, 2010 - August 19, 2010 作者:  Xiaohu, Yao[1];  Zerui, Fan[1];  Miaomiao, Yuan[1];  Xiaoqing, Zhang[1];  Zhiqiang, Li[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/16 Cellular telephone systems  Drops  Electronics packaging  Gages  Impact resistance  Packaging  Printed circuit manufacture  Research  Telecommunication equipment   Research on Reliability of Board Level Package-on-Package in Drop Test (CPCI-S收录) 会议论文 2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP) 作者:  Yao Xiaohu[1];  Fan Zerui[1];  Yuan Miaomiao[1];  Zhang Xiaoqing[1];  Li Zhiqiang[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/16