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A mixed shimming method in eliminating the gaps during the assembly process of the complex structures 会议论文
2ND INTERNATIONAL CONFERENCE ON FRONTIERS OF MATERIALS SYNTHESIS AND PROCESSING, 2019-01-01
作者:  Chang, Junhao;  Yang, Yuxing;  Liu, Xueshu;  Gao, Hang;  Wang, Yiqi
收藏  |  浏览/下载：112/0  |  提交时间：2019/12/02
Data-adaptive packing method for compression of dynamic point cloud sequences 会议论文
作者:  Liu, Jianqiang;  Yao, Jian;  Tu, Jingmin;  Cheng, Junhao
收藏  |  浏览/下载：12/0  |  提交时间：2019/12/05
Ensemble Learning Based Gender Recognition from Physiological Signals 会议论文
2018
作者:  Zhang, Huiling;  Guo, Ning;  Liu, Guangyuan;  Hu, Junhao;  Zhou, Jiaxiu
收藏  |  浏览/下载：42/0  |  提交时间：2019/01/31
The Influence of the Assembly Gaps and Tightening Operations on the Stress Distribution during the Assembly Process 会议论文
2018 2ND INTERNATIONAL CONFERENCE ON ADVANCED TECHNOLOGIES IN DESIGN, MECHANICAL AND AERONAUTICAL ENGINEERING (ATDMAE 2018), 2018-01-01
作者:  Chang, JunHao;  Liu, XueXhu;  Yang, YuXing;  Wang, Yiqi;  Gao, Hang
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/02
Characteristics of Transient Electric Field Induced by VFTO Based on Field Measurement 会议论文
作者:  Wu, Xutao;  Li, Xiuguang;  Liu, Shitao;  Guo, Fei;  Li, Junhao
收藏  |  浏览/下载：2/0  |  提交时间：2019/11/26
Breakdown Characteristics of Protrusion on HV Conductor in GIS Under Oscillating and Standard Lightning Impulse Voltages 会议论文
作者:  Zhang, Liang;  Liu, Zehui;  Han, Xutao;  Li, Junhao
收藏  |  浏览/下载：4/0  |  提交时间：2019/11/26
The partial discharge inception and breakdown voltage distribution of metal protrusion in SF6gas 会议论文
作者:  Guo, Fei;  Hu, Degui;  Li, Junhao;  Wu, Xutao;  Li, Xiuguang
收藏  |  浏览/下载：2/0  |  提交时间：2019/11/26
Spatiotemporal saliency detection using border connectivity 会议论文
8th International Conference on Digital Image Processing (ICDIP), 2016-05-20
作者:  Wu, Tongbao[1];  Liu, Zhi[2];  Li, Junhao[3]
收藏  |  浏览/下载：3/0  |  提交时间：2019/04/26
Effects of Soldering Temperature and Cooling Rate on the as-Soldered Microstructures of Intermetallic Compounds in Sn-0.7Cu/Cu Joint 会议论文
16 int conf elect packaging technology, Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA, 2015-08-11
作者:  Guo, Bingfeng;  Kunwar, Anil;  Ma, Haoran;  Liu, Jiahui;  Li, Shuang
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/09
In situ study on growth behavior of interfacial bubbles and its size effect on Sn-0.7cu/Cu interfacial reaction 会议论文
15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12
作者:  Sun, Junhao;  Du, Yao;  Kunwar, Anil;  Qu, Lin;  Li, Shuang
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09

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