CORC

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CORC

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A MAC Protocol with High Scalability for Motion Capture Based on Frequency Division Multiple and Time Division Multiple Access 会议论文
韩国济州岛, 2017
作者:  Yongfeng Wang;  Jie Li;  Shengyun Liang;  Dan Lin;  Yingnan Ma
收藏  |  浏览/下载：29/0  |  提交时间：2018/02/02
DEVELOPMENT OF WAFER LEVEL HYBRID BONDING PROCESS USING PHOTOSENSITIVE ADHESIVE AND CU PILLAR BUMP 会议论文
China Semiconductor Technology International Conference (CSTIC), Shanghai, PEOPLES R CHINA, 2017-03-12
作者:  Yao, Mingjun;  Yu, Daquan;  Zhao, Ning;  Fan, Jun;  Xiao, Zhiyi
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
Adaptive pre-compensation of the contouring error for high-precision parametric curved contour following 会议论文
ASME 2017 International Mechanical Engineering Congress and Exposition, IMECE 2017, Tampa, FL, United states, 2017-11-03
作者:  Ma, Jian-Wei;  Song, De-Ning;  Jia, Zhen-Yuan;  Zhang, Ning;  Hu, Guo-Qing
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/03
Power Generation Scheduling for Wind-Solar-Thermal Power Long Distance Consumption Based on Game-Theory 会议论文
2017 IEEE 7TH ANNUAL INTERNATIONAL CONFERENCE ON CYBER TECHNOLOGY IN AUTOMATION, CONTROL, AND INTELLIGENT SYSTEMS (CYBER), 2017-01-01
作者:  Ma, Tingting;  Yuan, Tiejiang;  Sun, Yiqian;  Chen, Ning;  Liu, Xiaofeng
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02
In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/Cu L-S interface during soldering heat preservation stage 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Guo, Bingfeng;  Jiang, Chengrong;  Kunwar, Anil;  Chen, Jun;  Zhao, Ning
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
Effect of Ag concentration on the Cu6Sn5 growth in Sn-based solder/Cu joints at the isothermal reflow stage 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Guo, Bingfeng;  Jiang, Chengrong;  Kunwar, Anil;  Zhao, Ning;  Chen, Jun
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
Formation of preferred orientation of Cu6Sn5 grains in Cu/Sn/Cu interconnects by soldering under temperature gradient 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Zhong, Yi;  Zhao, Ning;  Dong, Wei;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/03
Study on interfacial reactions in Cu/Sn-9Zn/Ni micro solder joints under temperature gradient 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Zhao, Ning;  Wang, Mingyao;  Zhong, Yi;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/03
Modeling and Simulation of Gas Turbine Starter and Fuel Control System 会议论文
PROCEEDINGS OF THE 36TH CHINESE CONTROL CONFERENCE (CCC 2017), 2017-01-01
作者:  Ma, Song;  Tan, Jianguo;  Ning, Yongqian;  Gao, Zichang
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/03
Mixed-integer Programming Model for Two-dimensional Non-guillotine Bin Packing Problem with Free Rotation 会议论文
作者:  Ma, Ning;  Zhou, Zhili
收藏  |  浏览/下载：3/0  |  提交时间：2019/11/26

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