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上海微系统与信息技... [41]
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期刊论文 [39]
会议论文 [2]
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2012 [4]
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TPMS (tire-pressure monitoring system) sensors: Monolithic integration of surface-micromachined piezoresistive pressure sensor and self-testable accelerometer
期刊论文
MICROELECTRONIC ENGINEERING, 2012, 卷号: 91, 页码: 167-173
Wei, CZ
;
Zhou, W
;
Wang, Q
;
Xia, XY
;
Li, XX
收藏
  |  
浏览/下载:26/0
  |  
提交时间:2013/04/23
Automotive sensor
Pressure sensor
Accelerometer
Piezoresistance
Surface-micromachining
Self-testing
Isotropic Silicon Etching With XeF2 Gas for Wafer-Level Micromachining Applications
期刊论文
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2012, 卷号: 21, 期号: 6, 页码: 1436-1444
Xu, DH
;
Xiong, B
;
Wu, GQ
;
Wang, YC
;
Sun, X
;
Wang, YL
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2013/04/23
Design rule
isotropic etching
microelectromechanical systems (MEMS)
micromachining
wafer level
XeF2 gas
Monolithic Integration of Pressure Plus Acceleration Composite TPMS Sensors With a Single-Sided Micromachining Technology
期刊论文
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2012, 卷号: 21, 期号: 2, 页码: 284-293
Wang, JC
;
Xia, XY
;
Li, XX
收藏
  |  
浏览/下载:27/0
  |  
提交时间:2013/04/23
Accelerometer
front-side monolithic micromachining
piezoresistance
pressure sensor
sensor
Uncooled Thermoelectric Infrared Sensor With Advanced Micromachining
期刊论文
IEEE SENSORS JOURNAL, 2012, 卷号: 12, 期号: 6, 页码: -
Xu, DH
;
Xiong, B
;
Wu, GQ
;
Ma, YL
;
Wang, YL
收藏
  |  
浏览/下载:15/0
  |  
提交时间:2013/04/23
Advanced micromachining
microelectromechanical systems (MEMS)
thermoelectric
uncooled infrared sensor
wet silicon etching
XeF2 silicon etching
On-chip integration of acceleration, pressure, and temperature composite sensor with a single-sided micromachining technique
期刊论文
Journal of Microelectromechanical Systems., 2011, 卷号: 20, 期号: 1, 页码: 42-52
Wang, Quan
;
Li,XX
;
Li,T
;
Bao, Minhang
;
Zhou, Wei
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2012/08/23
A single-wafer-based single-sided bulk-micromachining technique for high-yield and low-cost volume production of pressure sensors
期刊论文
2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11.2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11, 2011, 期号: 0, 页码: 410-413
Wang, Jiachou
;
Li, XX
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  |  
浏览/下载:11/0
  |  
提交时间:2012/08/23
On-chip integration of acceleration, pressure, and temperature composite sensor with a single-sided micromachining technique
期刊论文
Journal of Microelectromechanical Systems., 2011, 卷号: 20, 期号: 1, 页码: 42-52
Wang, Quan
;
Li,XX
;
Li,T
;
Bao, Minhang
;
Zhou, Wei
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2012/08/23
Improved micromachining of all SU-8 3D structures for a biologically-inspired flying robot
期刊论文
MICROELECTRONIC ENGINEERING, 2011, 卷号: 88, 期号: 8, 页码: 2218-2224
Bao, XQ(包晓晴)
;
Dargent, T
;
Grondel, S
;
Paquet, JB
;
Cattan, E
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  |  
浏览/下载:11/0
  |  
提交时间:2012/04/12
ELSEVIER SCIENCE BV
On-Chip Integration of Acceleration, Pressure, and Temperature Composite Sensor With a Single-Sided Micromachining Technique
期刊论文
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2011, 卷号: 20, 期号: 1, 页码: 42-52
Wang,QA
;
Li,XX
;
Li,T
;
Bao,MH
;
Zhou,W
收藏
  |  
浏览/下载:13/0
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提交时间:2012/04/12
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
A SINGLE-WAFER-BASED SINGLE-SIDED BULK-MICROMACHINING TECHNIQUE FOR HIGH-YIELD AND LOW-COST VOLUME PRODUCTION OF PRESSURE SENSORS
会议论文
Transducers’11:The 16th International Conference on Solid-State Sensors, Actuators and Microsystems, 2011
Jiachou Wang and Xinxin Li
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  |  
浏览/下载:20/0
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提交时间:2012/05/04
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