×
验证码:
换一张
忘记密码?
记住我
CORC
首页
科研机构
检索
知识图谱
申请加入
托管服务
登录
注册
在结果中检索
科研机构
大连理工大学 [219]
内容类型
期刊论文 [151]
会议论文 [63]
专利 [5]
发表日期
2019 [11]
2018 [29]
2017 [14]
2016 [16]
2015 [31]
2014 [12]
更多...
×
知识图谱
CORC
开始提交
已提交作品
待认领作品
已认领作品
未提交全文
收藏管理
QQ客服
官方微博
反馈留言
浏览/检索结果:
共219条,第1-10条
帮助
限定条件
专题:大连理工大学
第一署名单位
第一作者单位
通讯作者单位
已选(
0
)
清除
条数/页:
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
排序方式:
请选择
作者升序
作者降序
题名升序
题名降序
发表日期升序
发表日期降序
提交时间升序
提交时间降序
Crystallization behavior of iron-containing intermetallic compounds in al-si alloy under ultrasonic treatment
会议论文
Light Metals Symposium held at the TMS Annual Meeting and Exhibition, 2019, San Antonio, TX, United states, 2019-03-10
作者:
Zhang, Yubo
;
Wang, Tongmin
;
Li, Tingju
收藏
  |  
浏览/下载:12/0
  |  
提交时间:2019/12/02
Formation of Fe-Sn intermetallic layer and its effect on the corrosion of 304 stainless steel in high temperature water
期刊论文
INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE, 2019, 卷号: 14, 页码: 3217-3228
作者:
Guan, Jian-jun
;
Zhong, Hong-yuan
;
Feng, Li
;
Zhao, Yan
;
Liu, Feng
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2019/12/02
Sn, Stainless steel
Intermetallics, liquid-solid reactions
Oxidation
High temperature water
Diffusion-Limited Formation of Nonequilibrium Intermetallic Nanophase for Selective Dehydrogenation
期刊论文
NANO LETTERS, 2019, 卷号: 19, 页码: 4380-4383
作者:
Zhang, Guanghui
;
Ye, Chenliang
;
Liu, Wei
;
Zhang, Xiaoben
;
Su, Dangsheng
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2019/12/02
Nonequilibrium phase
intermetallic compounds
diffusion controlled
light alkane dehydrogenation
Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 2872-2887
作者:
Shang, Shengyan
;
Kunwar, Anil
;
Wang, Yanfeng
;
Qu, Lin
;
Ma, Haitao
收藏
  |  
浏览/下载:26/0
  |  
提交时间:2019/12/02
Binary alloys
Copper alloys
Film thickness
Intermetallics
Lead-free solders
Molluscs
Ostwald ripening
Soldering
Tin alloys, Cooling rates
Furnace cooling
Grain diameter
Growth behavior
Growth behaviour
Layer thickness
Non-uniformities
Reflow temperatures, Cooling
Geometrical Effects of Cu@Ag Core-Shell Nanoparticles Treated Flux on the Growth Behaviour of Intermetallics in Sn/Cu Solder Joints
期刊论文
ELECTRONIC MATERIALS LETTERS, 2019, 卷号: 15, 页码: 253-265
作者:
Shang, Shengyan
;
Kunwar, Anil
;
Wang, Yanfeng
;
Yao, Jinye
;
Wu, Yingchao
收藏
  |  
浏览/下载:29/0
  |  
提交时间:2019/12/02
Electronic materials
Intermetallic compounds
Crystal growth
Thermogravimetric analysis
Diffusion
Finite element method
Geometrical effects on growth kinetics of interfacial intermetallic compounds in Sn/Cu joints reflowed with Cu nanoparticles doped flux
期刊论文
THIN SOLID FILMS, 2019, 卷号: 669, 页码: 198-207
作者:
Shang, Shengyan
;
Kunwar, Anil
;
Yao, Jinye
;
Ma, Haitao
;
Wang, Yunpeng
收藏
  |  
浏览/下载:20/0
  |  
提交时间:2019/12/02
Solder
Intermetallic compounds film
Nanoparticles
Growth kinetics
Finite element method
Characterization of the nanoparticle and surface structure in platinum intermetallic alloy catalysts
期刊论文
ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2019, 卷号: 257
作者:
LiBretto, Nicole
;
Purdy, Stephen
;
Kropf, Arthur
;
Zhang, Guanghui
;
Miller, Jeffrey
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/12/02
Microstructure evolution of TC4 titanium alloy/316L stainless steel dissimilar joint vacuum-brazed with Ti-Zr-Cu amorphous filler metal
期刊论文
WELDING IN THE WORLD, 2019, 卷号: 63, 页码: 323-336
作者:
Xia, Yueqing
;
Dong, Honggang
;
Hao, Xiaohu
;
Li, Shuai
;
Li, Peng
收藏
  |  
浏览/下载:37/0
  |  
提交时间:2019/12/02
Vacuum brazing
Ti-Zr-Cu amorphous filler metal
Interfacial microstructure
Intermetallic compound (IMC)
Shear strength
Acid-tolerant intermetallic cobalt-nickel silicides as noble metal-like catalysts for selective hydrogenation of phthalic anhydride to phthalide
期刊论文
CATALYSIS SCIENCE & TECHNOLOGY, 2019, 卷号: 9, 页码: 1108-1116
作者:
Zhang, Liangliang
;
Chen, Xiao
;
Chen, Yujing
;
Peng, Zhijian
;
Liang, Changhai
收藏
  |  
浏览/下载:31/0
  |  
提交时间:2019/12/02
Acid resistance
Chemical vapor deposition
Cobalt
Corrosion resistance
Hydrogenation
Intermetallics
Nickel
Nickel compounds
Precious metals
Silicides, Activity measurements
Chemoselective hydrogenation
Intermetallic compound catalysts
Microwave assisted chemical vapor depositions
Noble metal catalysts
Phthalic anhydrides
Selective hydrogenation
Transition metal catalysts, Catalyst activity
Effect of the TiO2 Nanoparticles on the Growth Behavior of Intermetallics in Sn/Cu Solder Joints
期刊论文
METALS AND MATERIALS INTERNATIONAL, 2019, 卷号: 25, 页码: 499-507
作者:
Shang, Shengyan
;
Kunwar, Anil
;
Yao, Jinye
;
Wang, Yanfeng
;
Ma, Haitao
收藏
  |  
浏览/下载:27/0
  |  
提交时间:2019/12/02
TiO2 nanoparticles
Intermetallic compounds
Ostwald ripening
von Mises stress
Solder
Interface
©版权所有 ©2017 CSpace - Powered by
CSpace