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浏览/检索结果: 共7条，第1-7条 帮助 限定条件 专题：兰州理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Experimental study on electro-osmosis grouting reinforcement of scaling off earthen sites 期刊论文 Yanshilixue Yu Gongcheng Xuebao/Chinese Journal of Rock Mechanics and Engineering, 2021, 卷号: 40, 期号: 2, 页码: 390-398 作者:  Cui, Kai;  Cheng, Fuqiang;  Chen, Wenwu;  Ma, Qixin;  Xu, Pengfei 收藏  |  浏览/下载：13/0  |  提交时间：2021/04/12 Concrete construction  Disintegration  Electroosmosis  Energy utilization  Grouting  Mortar  Silicates  Sodium compounds  Soil testing  Soils  Electrode layout  Grouting reinforcements  Penetration resistances  Penetration test  Regular hexagon  Reinforced soil  Sodium silicate solutions  Structure characteristic   Investigation of Evolution Processes of Wafer Profiles With Edge Over Erosion in Copper CMP 期刊论文 IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2017, 卷号: 30, 期号: 1, 页码: 69-77 作者:  Wu, Lixiao;  Hahn, Sookap;  Yan, Changfeng 收藏  |  浏览/下载：7/0  |  提交时间：2019/11/15 Wafer profiles  edge over erosion  copper CMP   Investigation of evolution processes of wafer profiles with edge over erosion in copper CMP 期刊论文 IEEE Transactions on Semiconductor Manufacturing, 2017, 卷号: 30, 期号: 1, 页码: 69-77 作者:  Wu, Lixiao;  Hahn, Sookap;  Yan, Changfeng 收藏  |  浏览/下载：14/0  |  提交时间：2020/11/14 Copper  Linear systems  Polishing  Textile printing  Copper CMP  Evolution process  Frequency components  Pattern density  Pattern structure  Polishing parameters  Polishing time  Wafer profiles   Modeling of evolution process of edge over erosion in copper CMP using frequency components algorithm 会议论文 Shanghai, China, March 13, 2016 - March 14, 2016 作者:  Wu, Lixiao;  Hahn, Sookap;  Yan, Changfeng 收藏  |  浏览/下载：2/0  |  提交时间：2020/11/15 Copper  Linear systems  Polishing  Semiconductor device manufacture  Silicon wafers  Textile printing  Copper CMP  Evolution process  Frequency components  Pattern density  Pattern structure  Polishing processs  Square waves  Wafer patterns   MODELING OF EVOLUTION PROCESS OF EDGE OVER EROSION IN COPPER CMP USING FREQUENCY COMPONENTS ALGORITHM 会议论文 作者:  Wu, Lixiao;  Hahn, Sookap;  Yan, Changfeng 收藏  |  浏览/下载：4/0  |  提交时间：2019/11/15 Effects of Polishing Parameters on Evolution of Different Wafer Patterns During Cu CMP 期刊论文 IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2015, 卷号: 28, 期号: 1, 页码: 106-116 作者:  Wu, Lixiao;  Yan, Changfeng 收藏  |  浏览/下载：8/0  |  提交时间：2019/11/15 Polishing parameters  wafer patterns  chemical mechanical polishing (CMP)  linear system  contact pressure   Effects of polishing parameters on evolution of different wafer patterns during Cu CMP 期刊论文 IEEE Transactions on Semiconductor Manufacturing, 2015, 卷号: 28, 期号: 1, 页码: 106-116 作者:  Wu, Lixiao;  Yan, Changfeng 收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14 Copper  Elastic moduli  Erosion  Linear systems  Polishing  Topography  Chemical mechanical polishing(CMP)  Contact pressures  High selectivity  Polishing parameters  Polishing processs  Preston coefficients  Selectivity ratio  Wafer patterns