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浏览/检索结果: 共6条，第1-6条 帮助 限定条件 发表日期：2016    内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Three-dimensional phase-field lattice Boltzmann model for incompressible multiphase flows 会议论文 作者:  Wang, Ningning;  Liu, Haihu;  Zhang, Chuhua 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02 Phase-field model  Lattice Boltzmann method  Multiple relaxation time  Interfacial force  Multiphase flow   Parallel Overlapping Mechanism Between Communication and Computation of the Lattice Boltzmann Method 会议论文 3rd International Conference on High-Performance Computing and Applications (HPCA), 2015-07-26 作者:  Liu, Zhixiang[1];  Fang, Yong[2];  Song, Anping[3];  Xu, Lei[4];  Wang, Xiaowei[5] 收藏  |  浏览/下载：7/0  |  提交时间：2019/04/26 Lattice Moltzmann Method  Single-Relaxation-Time  Overlapping communication and computation  Hybrid model  Parallel model   Comparison of drag prediction using RANS models and DDES for the DLR-F6 configuration using high order schemes 会议论文 54th AIAA Aerospace Sciences Meeting, 2016, San Diego, CA, United states, January 4, 2016 - January 8, 2016 作者:  Gan JY;  Shen YQ(申义庆);  Zha GC 收藏  |  浏览/下载：17/0  |  提交时间：2017/05/05 Central differencing  Drag prediction  Finite difference scheme  High  order scheme  Line relaxation  Mesh refinement  Trailing edges  Turbulent models   A Convex Optimization-Based Approach for Time-Constrained Hypersonic Gliding 会议论文 IEEE Chinese Guidance, Navigation and Control Conference (CGNCC), Nanjing, PEOPLES R CHINA, 2016-08-12 作者:  Liu, Xinfu;  Yan, Tinggui;  He, Xinhua 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/30 Hypersonic Glide Vehicles  Second-Order Cone Programming  Relaxation  Flight Time Constraint  Impact Time Control   A Convex Optimization-Based Approach for Time-Constrained Hypersonic Gliding 会议论文 2016 IEEE CHINESE GUIDANCE, NAVIGATION AND CONTROL CONFERENCE (CGNCC), 2016-01-01 作者:  Liu, Xinfu;  Yan, Tinggui;  He, Xinhua 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/30 Hypersonic Glide Vehicles  Second-Order Cone Programming  Relaxation  Flight Time Constraint  Impact Time Control   Simulation and evaluation of thermal mechanical reliability of 3D-TSV stack with viscoelastic underfill 会议论文 Proceedings of the Electronic Packaging Technology Conference, EPTC, 2015-12-02 作者:  Zeng, Q.;  Guan, Y.;  Su, F.;  Chen, J.;  Jin, Y. 收藏  |  浏览/下载：7/0  |  提交时间：2019/12/30 Chip scale packages  Electronics packaging  Finite element method  Reliability  Thermal cycling  Viscoelasticity  Chip deformations  Relaxation modulus  Silicon interposers  Temperature dependent  Thermal-mechanical reliability  Time dependent  Viscoelastic properties  Williams-Landel-Ferry equations  Three dimensional integrated circuits