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浏览/检索结果: 共5条，第1-5条 帮助 限定条件 专题：武汉轻工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Effect of eddy current inducted heating on optical property and thermostability of high power LED 期刊论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, 页码: 819-822 作者:  Chen, Jibing*;  Wan, Nong;  Li, Juying;  He, Zhanwen;  Wu, Yiping 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/27 High-power LED  Microstructure  Proformance Thermal Fatigue  Reliability   Performances and microstructures of a high-power LED based on rapid thermal cycling 会议论文 18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, Harbin, PEOPLES R CHINA, AUG 16-19, 2017 作者:  Chen, Jibing*;  Wan, Nong;  Li, Juying;  He, Zhanwen;  Wu, Yiping 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/27 High-power LED  Microstructure  Proformance Thermal Fatigue  Reliability   A comparative study of properties and microstructures on thermal fatigue testing of a High-power LED 会议论文 17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, AUG 16-19, 2016 作者:  Chen, Jibing*;  Wan, Nong;  Li, Juying;  He, Zhanwen;  Wu, Yiping 收藏  |  浏览/下载：7/0  |  提交时间：2019/12/27 High-power LED  Microstructure  Property  Thermal Fatigue  Reliability   A 2-D analytical threshold-voltage model for GeOI/GeON MOSFET with high-k gate dielectric 期刊论文 Microelectronics Reliability, 2016, 卷号: 57, 页码: 24-33 作者:  Ji, Feng;  Xu, J.P.;  Liu, L.;  Tang, W.M.;  Lai, P.T. 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/27 GeOl/GeON MOSFETs  Threshold voltage  Ultra-thin-body  High-k gate dielectric   Influence of properties and microstructures on thermal fatigue testing of high-power LED 会议论文 16 int conf elect packaging technology, Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA, AUG 11-14, 2015 作者:  Chen, Jibing*;  Wan, Nong;  Li, Juying;  He, Zhanwen;  Yin, Yanfang 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/27 High-power LED  Microstructure  Property  Thermal Fatigue Testing  Reliability