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Graphene Based Heat Spreader for High Power Chip Cooling Using Flip-chip Technology 会议论文
Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC), 2013-12-11
作者:  Huang, Shirong[1];  Zhang, Yong[2];  Sun, Shuangxi[3];  Fan, Xiaogang[4];  Wang, Ling[5]
收藏  |  浏览/下载：10/0  |  提交时间：2019/04/30
High efficient BLDC controller for automobile cooling fan 会议论文
2010 International Conference on Intelligent System Design and Engineering Application, ISDEA 2010, 2010-10-13
作者:  Xu, Meihua[1];  Teng, Da[2];  Wang, Guoqin[3];  Fei, Yu[4]
收藏  |  浏览/下载：2/0  |  提交时间：2019/04/30
Study of speed control algorithm in four phase BLDC vehicle cooling fan controller 会议论文
2011 8th International Conference on Fuzzy Systems and Knowledge Discovery, FSKD 2011, Jointly with the 2011 7th International Conference on Natural Computation, ICNC'11, 2011-07-26
作者:  Xu, Meihua[1];  Zhao, Fangjie[2];  Wang, Guoqin[3];  Yang, Wenrong[4]
收藏  |  浏览/下载：2/0  |  提交时间：2019/04/30
FPGA-Based Cooling Fan Control System for Automobile Engine 会议论文
ADVANCES IN SWARM INTELLIGENCE, PT 2, PROCEEDINGS, 2010-06-12
作者:  Xu, Meihua[1];  Zhao, Fangjie[2];  Wang, Lianzhou[3]
收藏  |  浏览/下载：3/0  |  提交时间：2019/04/30
A study of effects of coolants on heat transfer capability of on-chip cooling with CNT micro-fin Architectures by using CFD simulation 会议论文
HDP'07: PROCEEDINGS OF THE 2007 INTERNATIONAL SYMPOSIUM ON HIGH DENSITY PACKAGING AND MICROSYSTEM INTEGRATION, 2007-06-26
作者:  Fan, Yi[1];  Zhong, Xiaolong[2];  Liu, Johan[3];  Wang, Teng[4];  Zhang, Yan[5]
收藏  |  浏览/下载：1/0  |  提交时间：2019/05/10
A study of CFD simulation for on-chip cooling with 2D CNT micro-fin array 会议论文
HDP'07: PROCEEDINGS OF THE 2007 INTERNATIONAL SYMPOSIUM ON HIGH DENSITY PACKAGING AND MICROSYSTEM INTEGRATION, 2007-06-26
作者:  Zhong, Xiaolong[1];  Fan, Yi[2];  Liu, Johan[3];  Zhang, Yan[4];  Wang, Teng[5]
收藏  |  浏览/下载：1/0  |  提交时间：2019/05/10
Numerical investigation based on CFD for air impingement heat transfer in electronics cooling 会议论文
2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05, 2005-06-27
作者:  Zhang, Yan[1];  Fan, Jing-Yu[2];  Liu, Johan[3]
收藏  |  浏览/下载：1/0  |  提交时间：2019/05/10
On the heat transfer enhancement based on micro-scale air impinging jets with microstructure heat sink in electronics cooling 会议论文
8th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP 06), 2006-06-27
作者:  Fan, Jing-yu[1];  Zhang, Yan[2];  Liu, Johan[3]
收藏  |  浏览/下载：4/0  |  提交时间：2019/05/10
Numerical investigation based on CFD for air impingement heat transfer in electronics cooling 会议论文
Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05)
作者:  Zhang, Yan[1];  Fan, Jing-yu[2];  Liu, Johan[3]
收藏  |  浏览/下载：1/0  |  提交时间：2019/05/10
Numerical investigation based on CFD for air impingement heat transfer in electronics cooling 会议论文
Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05)
作者:  Zhang, Yan[1];  Fan, Jing-yu[2];  Liu, Johan[3]
收藏  |  浏览/下载：1/0  |  提交时间：2019/05/10

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