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科研机构
北京航空航天大学 [74]
内容类型
期刊论文 [38]
会议论文 [36]
发表日期
2019 [8]
2018 [16]
2017 [6]
2016 [6]
2015 [8]
2014 [13]
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专题:北京航空航天大学
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Thermal shock fracture behavior of wave-transparent brittle materials in hypersonic vehicles under high thermal flux by digital image correlation
期刊论文
OPTICS EXPRESS, 2019, 卷号: 27, 页码: 10269-10279
作者:
Lin, Lujin
;
Wu, Dafang
;
Ren, Haoyuan
;
Zhu, Fanghui
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2019/12/30
Alumina
Aluminum oxide
Antennas
Brittleness
Circular waveguides
Domes
Electromagnetic waves
Fracture
Fracture mechanics
Hypersonic aerodynamics
Image analysis
Radar
Radar imaging
Radar tracking
Silica
Speckle
Strain measurement
Thermal shock
Digital image correlation methods
Digital image correlations
Reliability design
Speckle images
Surface strains
Target positioning
Thermal shock fracture
Wave-transparent
Hypersonic vehicles
Failure analysis and reliability evaluation of silver-sintered die attachment for high-temperature applications
期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 94, 页码: 46-55
作者:
Zhang, Hongqiang
;
Zhao, Zhenyu
;
Zou, Guisheng
;
Wang, Wengan
;
Liu, Lei
收藏
  |  
浏览/下载:56/0
  |  
提交时间:2019/12/30
Sintered Ag
Die attach
High temperature storage
Reliability
Power electronics
A Novel MTJ-Based Non-Volatile Ternary Content-Addressable Memory for High-Speed, Low-Power, and High-Reliable Search Operation
期刊论文
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 2019, 卷号: 66, 页码: 1454-1464
作者:
Wang, Chengzhi
;
Zhang, Deming
;
Zeng, Lang
;
Deng, Erya
;
Chen, Jie
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2019/12/30
MTJ
NV-TCAM
search reliability
ultra-low power
search delay
144-bit word circuit
Microstructural and mechanical evolution of silver sintering die attach for SiC power devices during high temperature applications
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2019, 卷号: 774, 页码: 487-494
作者:
Zhang, Hongqiang
;
Wang, Wengan
;
Bai, Hailin
;
Zou, Guisheng
;
Liu, Lei
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2019/12/30
Microstructure
High temperature storage
Reliability
Die attach
Nano-Ag paste
Industrial Big Data and Computational Sustainability: Multi-Method Comparison Driven by High-Dimensional Data for Improving Reliability and Sustainability of Complex Systems
期刊论文
SUSTAINABILITY, 2019, 卷号: 11
作者:
Liu, Chunting
;
Jia, Guozhu
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/12/30
industrial big data
computational sustainability
multi-method comparison
reliability and sustainability
high-dimensional data
High-temperature deformation measurement of the heated front surface of hypersonic aircraft component at 1200 °C using digital image correlation
期刊论文
Optics and Lasers in Engineering, 2019, 卷号: 122, 页码: 184-194
作者:
Wu, D.
;
Lin, L.
;
Ren, H.
;
Zhu, F.
;
Wang, H.
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/12/30
Aerodynamic heating
Aerodynamics
Alumina
Aluminum oxide
Atmospheric temperature
Chromium alloys
Deformation
Image analysis
Nickel alloys
Optical data processing
Reliability analysis
Strain measurement
Ternary alloys
Thermal expansion
Titanium alloys
Digital image correlation methods
Digital image correlations
High temperature
High temperature deformation
High-temperature environment
Nickel- based superalloys
Optical measurement systems
Thermal expansion coefficients
Hypersonic vehicles
Fracture performance test of wave transparent brittle materials of hypersonic vehicle under high-heat-flow thermal shock [高超声速飞行器脆性透波材料大热流冲击下断裂性能试验]
期刊论文
Hangkong Xuebao/Acta Aeronautica et Astronautica Sinica, 2019, 卷号: 40
作者:
Wu, D.
;
Lin, L.
;
Ren, H.
;
Zhu, F.
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2019/12/30
Alumina
Aluminum oxide
Antennas
Brittleness
Correlation methods
Electronics packaging
Fracture
Heat flux
Hypersonic aerodynamics
Image analysis
Infrared radiation
Locks (fasteners)
Silica
Speckle
Strain measurement
Thermal shock
Vehicle performance
Digital image correlation methods
Fracture performance
Fracture time
Location detection
Maximum heat flux
Reliability design
Shock simulation
Wave-transparent
Hypersonic vehicles
Fatigue fracture lifetime prediction for gold bonding wires of high-power LED under cyclically electrical loading [循环电载荷下大功率LED金引线疲劳断裂寿命预测]
期刊论文
Beijing Hangkong Hangtian Daxue Xuebao/Journal of Beijing University of Aeronautics and Astronautics, 2019, 卷号: 45, 页码: 478-485
作者:
Fan, J.
;
Li, L.
;
Qian, C.
;
Hu, A.
;
Fan, X.
收藏
  |  
浏览/下载:12/0
  |  
提交时间:2019/12/30
Fatigue of materials
Forecasting
Fracture
Gold
Outages
Reliability
Wire
Acceleration factors
Fatigue fracture
Gold bonding wires
High-power light-emitting diodes
Lifetime prediction
Mechanical simulations
Packaging technologies
Reliability assessments
Light emitting diodes
Spacecraft electrical signal classification method of reliability test based on random forest
期刊论文
Lecture Notes in Electrical Engineering, 2018, 卷号: 456, 页码: 457-465
作者:
Li, K.
;
Ran, R.
;
Song, S.
;
Wang, J.
;
Wang, L.
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2019/12/30
Computer aided diagnosis
Decision trees
Fault detection
Spacecraft
Systems engineering
Classification methods
Electrical signal
Feature extraction methods
High dimensions
Identification problem
Random forest algorithm
Reliability test
Wavelet denoising
Computational efficiency
Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages
期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 页码: 1254-1262
作者:
Jiang, Chengshuo
;
Fan, Jiajie
;
Qian, Cheng
;
Zhang, Hao
;
Fan, Xuejun
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/12/30
Chip-scale package (CSP)
flip-chip die attach
high-power light-emitting diode (LED)
reliability
voids
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