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Mechanical and Electrical Reliability Assessment of Bump-less Wafer-on-Wafer Integration with One-time Bottom-up TSV Filling 其他
2015-01-01
Guan, Yong; Zhu, Yunhui; Zeng, Qinghua; Ma, Shenglin; Su, Fei; Bian, Yuan; Zhong, Xiao; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载:3/0  |  提交时间:2017/12/03
Investigation on NiAl-TiC-Al2O3 composite prepared by self-propagation high temperature synthesis with hot extrusion 期刊论文
composites part b engineering, 2013
Sheng, L. Y.; Yang, F.; Guo, J. T.; Xi, T. F.; Ye, H. Q.
收藏  |  浏览/下载:2/0  |  提交时间:2015/11/10
山西断陷带地壳结构的接收函数研究 期刊论文
地球物理学报, 2010
唐有彩; 冯永革; 陈永顺; 周仕勇; 宁杰远; 魏松峤; 李鹏; 俞春泉; 范文渊; 王海洋
收藏  |  浏览/下载:5/0  |  提交时间:2015/10/24


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