CORC

浏览/检索结果: 共49条,第1-10条 帮助

限定条件                    
已选(0)清除 条数/页:   排序方式:
Oxidation Kinetics Researches under the Condition of Compressive Loading 会议论文
2018 2ND INTERNATIONAL CONFERENCE ON ADVANCED TECHNOLOGIES IN MANUFACTURING AND MATERIALS ENGINEERING (ATMME 2018), 2018-01-01
作者:  Zhou, C. H.;  Pan, R. Y.;  Ma, H. T.;  Zhang, H.;  Guan, X. G.
收藏  |  浏览/下载:4/0  |  提交时间:2019/12/02
Identification of Vessel Kinetics Based on Neural Networks via Concurrent Learning 会议论文
ADVANCES IN NEURAL NETWORKS - ISNN 2018, 2018-01-01
作者:  Gu, Nan;  Liu, Lu;  Wang, Dan;  Peng, Zhouhua
收藏  |  浏览/下载:9/0  |  提交时间:2019/12/02
Hydrocarbons Synthesis from CO2 Hydrogenation over Fe-based Catalysts: Reaction Pathways and Kinetics from DFT 会议论文
255th ACS National Meeting & Exposition
作者:  Nie XW(聂小娃)
收藏  |  浏览/下载:2/0  |  提交时间:2019/12/02
Effect of Ag content on Cu6Sn5 growth behavior at Sn-Ag/Cu solder interface during multiple reflows 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Ma, Haoran;  Yao, Jinye;  Wang, Chen;  Shang, Shengyan;  Wang, Yunpeng
收藏  |  浏览/下载:6/0  |  提交时间:2019/12/02
Mechanism of Cu5Zn8 layer act as a diffusion barrier layer 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Yao, Jinye;  Li, Hua;  Huang, Ru;  Qi, Xiao;  Wang, Boyin
收藏  |  浏览/下载:2/0  |  提交时间:2019/12/02
Kinetics of waterborne fluoropolymers prepared by one-step semi-continuous emulsion polymerization of chlorotrifluoroethylene, vinyl acetate, butyl acrylate andVeova 10 会议论文
2ND INTERNATIONAL CONFERENCE ON NEW MATERIAL AND CHEMICAL INDUSTRY (NMCI2017), 2018-01-01
作者:  Liu, H. Z.;  Wang, M. H.;  Wang, Z. F.;  Bian, J. M.
收藏  |  浏览/下载:7/0  |  提交时间:2019/12/02
Kinetics of waterborne fluoropolymers prepared by one-step semi-continuous emulsion polymerization of chlorotrifluoroethylene, vinyl acetate, butyl acrylate and veova 10 会议论文
IOP Conf. Series: Materials Science and Engineering
作者:  Bian JM(边继明)
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/02
The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during multiple reflows 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Ma, H. R.;  Wang, Y. P.;  Chen, J.;  Ma, H. T.;  Zhao, N.
收藏  |  浏览/下载:4/0  |  提交时间:2019/12/03
The effect of cooling rate on growth kinetics of interfacial IMCs during multiple reflows 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Ma, H. R.;  Li, S.;  Yao, M. J.;  Wang, Y. P.;  Chen, J.
收藏  |  浏览/下载:4/0  |  提交时间:2019/12/03
The effect of cooling rate on growth kinetics of interfacial IMCs during multiple reflows 会议论文
18th International Conference on Electronic Packaging Technology, ICEPT 2017, Harbin, China, 2017-08-16
作者:  Ma, H.R.;  Li, S.;  Yao, M.J.;  Wang, Y.P.;  Chen, J.
收藏  |  浏览/下载:6/0  |  提交时间:2019/12/03


©版权所有 ©2017 CSpace - Powered by CSpace