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浏览/检索结果: 共4条，第1-4条 帮助 限定条件 学科主题：半导体器件     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Super-aligned carbon nanotubes patterned sapphire substrate to improve quantum efficiency of InGaN/GaN light-emitting diodes 期刊论文 optics express, 2015, 卷号: 23, 期号: 15, 页码: a957-a965 Liang Shan; Tongbo Wei; Yuanping Sun; Yonghui Zhang; Aigong Zhen; Zhuo Xiong; Yang Wei; Guodong Yuan; Junxi Wang; Jinmin Li 收藏  |  浏览/下载：10/0  |  提交时间：2016/04/15 Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging 期刊论文 journal of materials science-materials in electronics, 2014, 卷号: 25, 期号: 11, 页码: 4954-4959 Liu, Yang; Meerwijk, Joost; Luo, Liangliang; Zhang, Honglin; Sun, Fenglian; Yuan, Cadmus A.; Zhang, Guoqi 收藏  |  浏览/下载：21/0  |  提交时间：2015/03/20 Chip-on-Flexible Packaging for High-Power Flip-Chip Light-Emitting Diode by AuSn and SAC Soldering 期刊论文 ieee transactions on components packaging and manufacturing technology, 2014, 卷号: 4, 期号: 11, 页码: 1754-1759 Liu, Yang; Zhao, Jia; Yuan, Cadmus Chang-Ann; Zhang, Guoqi Q; Sun, Fenglian 收藏  |  浏览/下载：16/0  |  提交时间：2015/03/20 Thermal and mechanical effects of voids within flip chip soldering in LED packages 期刊论文 microelectronics reliability, 2014, 卷号: 54, 期号: 9-10, 页码: 2028-2033 Liu, Y; Leung, SYY; Zhao, J; Wong, CKY; Yuan, CA; Zhang, GQ; Sun, FL; Luo, LL 收藏  |  浏览/下载：18/0  |  提交时间：2015/03/25