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Photoelectric conversion behavior based on direct interfacial charge-transfer from porphyrin derivative to silicon nanowires 期刊论文
APPLIED PHYSICS LETTERS, 2010, 卷号: 97, 期号: 25
作者:  Wen, Liping;  Liu, Xiaofeng;  Yang, Nailiang;  Zhai, Jin;  Huang, Changshui
收藏  |  浏览/下载:12/0  |  提交时间:2019/04/09
Understanding of the influence of process parameters on the heat transfer behavior at the metal/die interface in high pressure die casting process 期刊论文
2010, 2010
Guo ZhiPeng; Xiong ShouMei; Liu BaiCheng; Li Mei; John, Allison
收藏  |  浏览/下载:3/0
Micro/nanoscale mechanical characterization and in situ observation of cracking of laminated Si3N4/BN composites 期刊论文
2010, 2010
Li, Xiaodong; Zou, Linhua; Ni, Hai; Reynolds, Anthony R.; Wang, Chang-an; Huang, Yong
收藏  |  浏览/下载:5/0
Liquid Film Characteristics on Surface of Structured Packing 期刊论文
2010, 2010
Luo Shujuan; Li Huaizhi; Fei Weiyang; Wang Yundong
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Controllable and switchable capillary adhesion mechanism for bio-adhesive pads: Effect of micro patterns 期刊论文
2010, 2010
Zhang XiangJun; Liu Yuan; Liu YongHe; Ahmed, S. I. -U
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Numerical simulations of the normal impact of adhesive microparticles with a rigid substrate 期刊论文
2010, 2010
Feng, Xi-Qiao; Li, Huan; Zhao, Hong-Ping; Yu, Sholi-Wen
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RELATIONSHIP BETWEEN METAL-DIE INTERFACIAL HEAT TRANSFER COEFFICIENT AND CASTING SOLIDIFICATION RATE IN HIGH PRESSURE DIE CASTING PROCESS 期刊论文
2010, 2010
Guo Zhipeng; Xiong Shoumei; Mei Li; Allison, John
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An estimation method on failure stress of micro thickness Cu film-substrate structure 期刊论文
2010, 2010
Wang XiShu; Li Ying; Meng XiangKang
收藏  |  浏览/下载:3/0
Effect of upper contact line on sliding behavior of water droplet on superhydrophobic surface 期刊论文
2010, 2010
Yang ChangWei; Hao PengFei; He Feng
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THERMOMECHANICAL MODELING OF SOLIDIFICATION PROCESS OF SQUEEZE CASTING I. Mathematic Model and Solution Methodology 期刊论文
2010, 2010
Han Zhiqiang; Zhu Wei; Liu Baicheng
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