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兰州理工大学 [13]
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期刊论文 [39]
会议论文 [2]
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2019 [6]
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Hexagonal boron nitride quantum dots: Properties, preparation and applications
期刊论文
Materials Today Chemistry, 2021, 卷号: 20
作者:
Zhang, Xiaofang
;
An, Lulu
;
Bai, Changning
;
Chen, Li
;
Yu, Yuanlie
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2021/04/12
Biocompatibility
Boron nitride
Chemical detection
Chemical stability
Diagnosis
Fabrication
Fluorescence imaging
III-V semiconductors
Metal ions
Metals
Nanocrystals
Nitrides
Disease diagnosis
Fabrication method
Hexagonal boron nitride
Large-scale fabrication
Low cytotoxicities
Metal ion detection
Photoluminescence properties
Recent researches
Boron nitride nanocomposites for microwave absorption: A review
期刊论文
Materials Today Nano, 2021, 卷号: 13
作者:
Wang, F.
;
Bai, C.
;
Chen, L.
;
Yu, Y.
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2021/03/02
Boron nitride
Chemical stability
Dielectric properties of solids
Electromagnetic pulse
III-V semiconductors
Nitrides
Thermal conductivity
Engineering applications
Hexagonal boron nitride (h-BN)
High thermal stability
Low fillings
Microwave absorption
Military fields
Research interests
Strong absorptions
Wetting of AlN by moten Cu-8.6Zr-xTi ternary alloys at 1373 K
期刊论文
Acta Materialia, 2021, 卷号: 203
作者:
Lin, Qiaoli
;
Wang, Le
;
Sui, Ran
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2020/12/18
Aluminum alloys
Aluminum nitride
Binary alloys
Copper alloys
Eutectics
III-V semiconductors
Precipitation (chemical)
Ternary alloys
Thermoanalysis
Titanium alloys
Titanium nitride
Wetting
Zirconium compoundsBinary eutectics
Eutectic alloys
Modified sessile drop method
Reaction layers
Spreading dynamics
Thermo dynamic analysis
Ti addition
Zirconium nitride
Significant improvement of thermal conductivity for AlN/LAS composite with low thermal expansion
期刊论文
Ceramics International, 2020, 卷号: 46, 期号: 18, 页码: 28668-28675
作者:
Li, Zhenyu
;
Wang, Chi
;
Xia, Long
;
Yang, Hua
;
Qin, Chunlin
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2022/02/17
Aluminum nitride
Expansion
Heat conduction
III-V semiconductors
Lithium compounds
Thermal expansion
High thermal conductivity
Lithium aluminosilicate
Low coefficient of thermal expansions
Low thermal expansion
Precision instrument
Reinforcing phase
Thermal functions
Significant improvement of thermal conductivity for AlN/LAS composite with low thermal expansion
期刊论文
Ceramics International, 2020, 卷号: 46, 期号: 18, 页码: 28668-28675
作者:
Li, Zhenyu
;
Wang, Chi
;
Xia, Long
;
Yang, Hua
;
Qin, Chunlin
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2020/11/14
Aluminum nitride
Expansion
Heat conduction
III-V semiconductors
Lithium compounds
Thermal expansion
High thermal conductivity
Lithium aluminosilicate
Low coefficient of thermal expansions
Low thermal expansion
Precision instrument
Reinforcing phase
Thermal functions
Effect of Al and Mo Content on the Microstructures and Tensile Property of FeCrAlMo Alloys
期刊论文
Cailiao Daobao/Materials Reports, 2020, 卷号: 34, 期号: 12, 页码: 12105-12109
作者:
Wang, Tiejun
;
Qin, Wei
;
Chen, Yongqing
;
Yan, Yingjie
;
Cao, Rui
收藏
  |  
浏览/下载:26/0
  |  
提交时间:2020/11/14
Aluminum nitride
Chromium alloys
Grain boundaries
Hot isostatic pressing
III-V semiconductors
Iron alloys
Microstructure
Molybdenum alloys
Oxidation resistance
Plasticity
Precipitation (chemical)
Tensile strength
Ternary alloys
Chemical compositions
Elevated temperature
FeCrAl alloys
High temperature
Large-sized
Mo content
Oxycarbides
Strength and plasticities
Effect of Al and Mo Content on the Microstructures and Tensile Property of FeCrAlMo Alloys
期刊论文
Cailiao Daobao/Materials Reports, 2020, 卷号: 34, 期号: 12, 页码: 12105-12109
作者:
Wang, Tiejun
;
Qin, Wei
;
Chen, Yongqing
;
Yan, Yingjie
;
Cao, Rui
收藏
  |  
浏览/下载:22/0
  |  
提交时间:2022/02/17
Aluminum nitride
Chromium alloys
Grain boundaries
Hot isostatic pressing
III-V semiconductors
Iron alloys
Microstructure
Molybdenum alloys
Oxidation resistance
Plasticity
Precipitation (chemical)
Tensile strength
Ternary alloys
Chemical compositions
Elevated temperature
FeCrAl alloys
High temperature
Large-sized
Mo content
Oxycarbides
Strength and plasticities
Multilayer boron nitride nanofilm as an effective barrier for atomic oxygen irradiation
期刊论文
Applied Surface Science, 2020, 卷号: 504
作者:
Cheng, Li
;
Shi, Yanbin
;
Hao, Yu
;
Li, Wensheng
;
Ren, Siming
收藏
  |  
浏览/下载:15/0
  |  
提交时间:2020/11/14
Atoms
Boron nitride
III-V semiconductors
Irradiation
Molecular dynamics
Molecular oxygen
Monolayers
Multilayer films
Multilayers
Nitrides
Organic polymers
Oxidation
Oxidation resistance
Anti-oxidation
AO irradiations
Atomic oxygen
Atomic oxygen irradiation
Barrier performance
Molecular dynamics simulations
Nano films
Structural analogue
Superhydrophobicity of polyvinylidene fluoride induced by integrating liquid-exfoliated hexagonal boron nitride nanosheets
期刊论文
High Performance Polymers, 2020, 卷号: 32, 期号: 1, 页码: 73-82
作者:
An, Lulu
;
Bai, Changning
;
Bai, Yongqing
;
Zhang, Bin
;
Yu, Yuanlie
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2020/11/14
Boron nitride
Fluorine compounds
III-V semiconductors
Membranes
Morphology
Nanosheets
Nitrides
Waste treatment
Wastewater treatment
Water treatment
Hexagonal boron nitride
Hierarchical structures
Oil/water separation
Polyvinylidene fluorides
Superhydrophobicity
Dielectric and thermal properties of micro/nano boron nitride co-filled EPDM composites for high-voltage insulation
期刊论文
MICRO & NANO LETTERS, 2019, 卷号: 14, 页码: 150-153
作者:
Nazir, Muhammad Tariq
;
Bao Toan Phung
;
Zhang, Yuanyuan
;
Li, Shengtao
收藏
  |  
浏览/下载:34/0
  |  
提交时间:2019/11/19
nanocomposites
thermogravimetric analysis
BN
dielectric loss
dielectric losses
blending
EPDM composite samples
filled polymers
hot press application
high-voltage insulation
ethylene propylene diene monomer
nanoparticles
thermal analysis
broadband dielectric spectroscopy
hot pressing
wide band gap semiconductors
polymeric material
dielectric constant
thermal conductivity
dielectric properties
EPDM matrix
nanoboron nitride cofilled EPDM composites
melt-blending
electrical insulation applications
composite insulating materials
residual masses
nanocofilled contents
microcofilled contents
nanoBN particles
denser packing geometry
pyrolysis
boron compounds
thermal properties
microboron nitride cofilled EPDM composites
microBN particles
melt processing
initial degradation temperature
III-V semiconductors
permittivity
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