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CORC

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Preparation and characterization of the double-side adhesive tape with reactive properties and high thermal conductivity for electronic packaging 会议论文
上海, 2018
作者:  Chang Hao;  Zhang Baotan;  Sun Rong
收藏  |  浏览/下载：30/0  |  提交时间：2019/01/31
Synthesis and characterization of silica–silver core-shell structural spheres and its application in conductive adhesive 会议论文
Harbin, China
作者:  Jinze Li;  Baotan Zhang;  Pengli Zhu;  Yuan Gao;  Rong Sun
收藏  |  浏览/下载：18/0  |  提交时间：2018/02/02
Liquid Epoxy Molding Compound with High Glass Transition Temperature and High Thermal Conductivity 会议论文
Harbin, China
作者:  Jinze Li;  Baotan Zhang;  Pengli Zhu;  Gang Li;  Rong Sun
收藏  |  浏览/下载：18/0  |  提交时间：2018/02/02
Synthesis and characterization of silica-silver core-shell structural spheres and its application in conductive adhesive 会议论文
18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, Harbin, PEOPLES R CHINA
作者:  Li, Jinze;  Zhang, Baotan;  Zhu, Pengli;  Gao, Yuan;  Sun, Rong
收藏  |  浏览/下载：4/0  |  提交时间：2020/01/03
Liquid Epoxy Molding Compound with High Glass Transition Temperature and High Thermal Conductivity 会议论文
18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, Harbin, PEOPLES R CHINA
作者:  Li, Jinze;  Zhang, Baotan;  Zhu, Pengli;  Li, Gang;  Sun, Rong
收藏  |  浏览/下载：6/0  |  提交时间：2020/01/03
Synthesis and characterization of silica-silver core-shell structural spheres and its application in conductive adhesive 会议论文
18th International Conference on Electronic Packaging Technology, ICEPT 2017, Harbin, China, 2017-08-16
作者:  Li, Jinze;  Zhang, Baotan;  Zhu, Pengli;  Gao, Yuan;  Sun, Rong
收藏  |  浏览/下载：2/0  |  提交时间：2020/01/03
Liquid epoxy molding compound with high glass transition temperature and high thermal conductivity 会议论文
18th International Conference on Electronic Packaging Technology, ICEPT 2017, Harbin, China, 2017-08-16
作者:  Li, Jinze;  Zhang, Baotan;  Zhu, Pengli;  Li, Gang;  Sun, Rong
收藏  |  浏览/下载：4/0  |  提交时间：2020/01/03
Novel Underfill Material Having Low Coefficeint of Thermal Expansione 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:  Zhang Baotan;  Sun Rong;  Zhu Pengli
收藏  |  浏览/下载：16/0  |  提交时间：2017/01/15
Cure kinetics study of a Novel Die Attach Adhesive for High Power Light-Emitting Diode 会议论文
China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China
作者:  Baotan Zhang;  Rong Sun;  Yankang Han;  Pengli Zhu;  Daoqiang(Daniel) Lu
收藏  |  浏览/下载：28/0  |  提交时间：2017/01/15
Preparation of highly conductive adhesives by in-stiu incorporation of silver nanoparticles 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:  Yankang Han;  Baotan Zhang;  Pengli Zhu;  Shulei Huang;  Qianqian Liu
收藏  |  浏览/下载：32/0  |  提交时间：2017/01/15

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