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浏览/检索结果: 共7条，第1-7条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Swing Touch Risk Assessment of Bonding Wires in High-Density Package Under Mechanical Shock Condition 期刊论文 JOURNAL OF ELECTRONIC PACKAGING, 2019, 卷号: 141 作者:  Fu, Guicui;  Jiang, Maogong;  Wan, Bo;  Li, Yanruoyue;  Ma, Cheng 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/30 bonding wire  touch risk assessment  high-density package  mechanical shock   Storage PoF model of electromagnetic relays based on electrical contact theory 期刊论文 Microelectronics Reliability, 2019, 卷号: 100-101 作者:  Guo, Wendi;  Fu, Guicui;  Wan, Bo;  Jiang, Maogong;  Li, Yanruoyue 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/30 Failure analysis of solder layer in power transistor 期刊论文 SOLDERING & SURFACE MOUNT TECHNOLOGY, 2018, 卷号: 30, 页码: 49-56 作者:  Jiang, Maogong;  Fu, Guicui;  Wan, Bo;  Xue, Peng;  Qiu, Yao 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/30 Failure analysis  Oxidation  Power transistor  Solder layer   Research on physics-of-failure model for electro-migration damage accumulation under multi-level stress profile based on accelerated factor 会议论文 PROCEEDINGS OF THE 2ND INTERNATIONAL CONFERENCE ON RELIABILITY SYSTEMS ENGINEERING (ICRSE 2017), 2017-01-01 作者:  Wan, Bo;  Fu, Guicui;  Li, Yanruoyue 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/30 component  formatting  electro-migration  damage accumulation  multi-level stress  accelerated factor   Research on physics-of-failure model for electromigration damage accumulation under multi-level stress profile based on accelerated factor 会议论文 2nd International Conference on Reliability Systems Engineering, ICRSE 2017, Huairou, Beijing, China, 2017-07-10 作者:  Wan, Bo;  Fu, Guicui;  Li, Yanruoyue 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/30 Research on a Defects Detection Method in the Ferrite Phase Shifter Cementing Process Based on a Multi-Sensor Prognostic and Health Management (PHM) System 期刊论文 SENSORS, 2016, 卷号: 16 作者:  Wan, Bo;  Fu, Guicui;  Li, Yanruoyue;  Zhao, Youhu 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/30 multi-sensor  prognostic and health management  cementing strength   Failure analysis of the electromagnetic relay contacts 期刊论文 ENGINEERING FAILURE ANALYSIS, 2016, 卷号: 59, 页码: 304-313 作者:  Wan, Bo;  Fu, Guicui;  Li, Yanruoyue;  Zhao, Youhu;  Jia, Meisi 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/30 Long-term storage  Electromagnetic relay contact  Mechanical damage  Inorganic and organic contamination