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An overview on membrane strategies for rare earths extraction and separation 期刊论文
SEPARATION AND PURIFICATION TECHNOLOGY, 2018, 卷号: 197, 页码: 70-85
作者:  Chen, Li[1];  Wu, Yilin[2];  Dong, Hongjun[3];  Meng, Minjia[4];  Li, Chunxiang[5]
收藏  |  浏览/下载:8/0  |  提交时间:2019/12/24
Synergetic effect of carbon sphere derived from yeast with magnetism and cobalt oxide nanochains towards improving photodegradation activity for various pollutants 期刊论文
APPLIED CATALYSIS B-ENVIRONMENTAL, 2018, 卷号: 220, 页码: 137-147
作者:  Zhao, Xiaoxu[1];  Lu, Ziyang[2];  Wei, Maobin[3];  Zhang, Menghan[4];  Dong, Hongjun[5]
收藏  |  浏览/下载:2/0  |  提交时间:2019/12/24
A PET-CT study on the specificity of acupoints through acupuncture treatment in migraine patients 期刊论文
2012, 卷号: 12
作者:  Yang, Jie[1];  Zeng, Fang[1];  Feng, Yue[1];  Fang, Li[3];  Qin, Wei[2]
收藏  |  浏览/下载:7/0  |  提交时间:2019/12/06
The ECG recording and analysis instrumentation based on virtual instrument technology and continuous wavelet transform 会议论文
Cancun, MEXICO, SEP 17-21, 2003
作者:  Qin, Shuren[1];  Ji, Zhong[1];  Zhu, Hongjun[1]
收藏  |  浏览/下载:0/0  |  提交时间:2019/11/28
The ECG recording and analysis instrumentation based on virtual instrument technology and continuous wavelet transform 会议论文
Cancun, Mexico, September 17, 2003 - September 21, 2003
作者:  Qin, Shuren[1];  Ji, Zhong[1];  Zhu, Hongjun[1]
收藏  |  浏览/下载:1/0  |  提交时间:2019/11/30
Comparison of bond interface reaction in Al-Ni and Al-Au systems formed by utrasonic wedge bonding (CPCI-S收录) 会议论文
2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3
作者:  Li, Mingyu[1];  Ji, Hongjun[2];  Wang, Chunqing[2]
收藏  |  浏览/下载:4/0  |  提交时间:2019/04/18
Observation of ultrasonic Al-Si wire wedge bond interface using high resolution transmission electron microscope (CPCI-S收录) 会议论文
ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS
作者:  
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/17
Ultrasonic-assisted Soldering of Sn-based Solder Alloys to Form Intermetallic Interconnects for High Temperature Application (CPCI-S收录) 会议
作者:  Ji, Hongjun[1];  Li, Mingyu[1];  Qiao, Yunfei[1]
收藏  |  浏览/下载:5/0  |  提交时间:2019/04/11
The low temperature exothermic sintering of formic acid treated Cu nanoparticles for conductive ink (CPCI-S收录) 会议
作者:  Liu, Jingdong[1];  Ji, Hongjun[1];  Wang, Shuai[2];  Li, Mingyu[1]
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/11
Pressureless Low Temperature Sintering of Ag Nanoparticles for Interconnects (CPCI-S收录) 会议论文
14TH INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING (EMAP 2012)
作者:  Wang, Shuai[1];  Ji, Hongjun[1];  Li, Mingyu[1];  Kim, Jongmyung;  Kim, Hongbae[2]
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/15


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