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CORC

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Comparison and mechanism of electromigration reliability between Cu wire and Au wire bonding in molding state 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 卷号: 31, 期号: 4, 页码: 2967-2975
作者:  Du, Yahong;  Gao, Li-Yin;  Yu, Daquan;  Liu, Zhi-Quan
收藏  |  浏览/下载：19/0  |  提交时间：2021/02/03
Reliability of Ultra-Thin Embedded Silicon Fan-Out (eSiFO) Package Directly Assembled on PCB for Mobile Applications 会议论文
作者:  Chen C(陈诚);  Teng Wang;  Wan LX(万里兮);  Yu DQ(于大全);  Shuying Ma
收藏  |  浏览/下载：33/0  |  提交时间：2019/05/15
Imparting designer biorecognition functionality to metal-organic frameworks by a dna-mediated surface engineering strategy 期刊论文
Small, 2018, 卷号: 14, 期号: 11, 页码: 8
作者:  Ning, Weiyu;  Di, Zhenghan;  Yu, Yingjie;  Zeng, Pingmei;  Di, Chunzhi
收藏  |  浏览/下载：95/0  |  提交时间：2019/04/23
Mode splitting induced by an arbitrarily shaped Rayleigh scatterer in a whispering-gallery microcavity 期刊论文
Physical Review A, 2018, 卷号: 97, 期号: 6, 页码: 063828
作者:  Yinglun Xu;   Shui-Jing Tang;   Xiao-Chong Yu;   You-Ling Chen;   Daquan Yang;   Qihuang Gong;   Yun-Feng Xiao
收藏  |  浏览/下载：20/0  |  提交时间：2019/11/12
Process development and reliability for wafer-level 3D IC integration using micro-bump/adhesive hybrid bonding and via-last TSVs 会议论文
19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：14/0  |  提交时间：2019/12/02
Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesive hybrid bonding and via-last TSVs 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02
Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Adhesive Film Hybrid Bonding and Via-Last TSVs 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2018, 卷号: 47, 页码: 7544-7557
作者:  Yao, Mingjun;  Zhao, Ning;  Wang, Teng;  Yu, Daquan;  Xiao, Zhiyi
收藏  |  浏览/下载：16/0  |  提交时间：2019/12/02
Optimization and Characterization of Low-Temperature Wafer-Level Hybrid Bonding Using Photopatternable Dry Film Adhesive and Symmetric Micro Cu Pillar Solder Bumps 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 页码: 1855-1862
作者:  Yao, Mingjun;  Zhao, Ning;  Wang, Teng;  Yu, Daquan;  Xiao, Zhiyi
收藏  |  浏览/下载：13/0  |  提交时间：2019/12/02
Performance evaluation of asphalt mixtures containing recycled concrete aggregates 期刊论文
INTERNATIONAL JOURNAL OF PAVEMENT ENGINEERING, 2018, 卷号: 19, 页码: 422-428
作者:  Sun Daquan;  Tian Yang;  Sun Guoqiang;  Pang Qi;  Yu Fan
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02
以硅通孔为核心的三维系统集成技术及应用 成果
2018
主要完成人:  孙鹏;  戴风伟;  肖智轶;  于大全;  张文奇
收藏  |  浏览/下载：44/0  |  提交时间：2019/05/24

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