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浏览/检索结果: 共3条，第1-3条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Solid-State-Diffusion Bonding for Wafer-Level Fine-Pitch Cu/Sn/Cu Interconnect in 3-D Integration 期刊论文 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2017, 卷号: 7, 页码: 19-26 作者:  Wang, Junqiang;  Wang, Qian;  Wu, Zijian;  Wang, Dejun;  Cai, Jian 收藏  |  浏览/下载：11/0  |  提交时间：2019/12/02 Cu/Sn/Cu interconnect  fine-pitch interconnect  solid-state-diffusion (SSD) bonding  wafer-level bonding   Effects of Current Stress for Low Temperature Cu/Sn/Cu Solid-State-Diffusion Bonding 会议论文 2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017-01-01 作者:  Cai, Jian;  Wang, Qian;  Wang, Dejun;  Wang, Junqiang;  Wu, Zijian 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/09 3D integration  solid-state-diffusion (SSD)  bonding  surface pretreatment  electromigration (EM)   Study on Ar(5%H-2) Plasma Pretreatment for Cu/Sn/Cu Solid-State-Diffusion Bonding in 3D Interconnection 会议论文 66th IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, NV, 2016-05-31 作者:  Wang, Junqiang;  Wang, Qian;  Wang, Dejun;  Cai, Jian 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09 3D interconnection  solid-state-diffusion (SSD) bonding  plasma pretreatment  surface activation