CORC

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CORC

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Interfacial Structure and Mechanical Properties of Lead-Free Bi-Containing Solder/Cu Microelectronic Interconnects 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2021, 卷号: 50, 期号: 1, 页码: 258-262
作者:  Liu, C. Z.;  Wang, J. J.;  Zhu, M. W.;  Liu, X. M.;  Lu, T. N.
收藏  |  浏览/下载：25/0  |  提交时间：2021/02/03
Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure 期刊论文
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2018, 卷号: 6, 期号: 1, 页码: 175, 187
作者:  Zhang, Hui;  Li, Jianfeng;  Dai, Jingru;  Corfield, Martin;  Liu, Xuejian
收藏  |  浏览/下载：31/0  |  提交时间：2018/12/28
Thermal stability of high temperature Pb-free solder interconnect characterised by in-situ electron microscopy 会议论文
7th Electronic System-Integration Technology Conference (ESTC), Dresden, GERMANY, SEP 18-21, 2018
作者:  Zhou, Zhaoxia*;  Liu, Li;  Liu, Changqing
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/04
In situ study on the effect of Cu5Zn8 intermetallic layer on the Cu-Ni cross interaction in Cu/Sn-9Zn/Ni interconnect under temperature gradient 期刊论文
MATERIALS CHEMISTRY AND PHYSICS, 2018, 卷号: 216, 页码: 130-135
作者:  Zhong, Y.;  Zhao, N.;  Dong, W.;  Wang, Y. P.;  Ma, H. T.
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/02
Failure mechanisms of solder interconnects under current stressing - A progress update from recent studies on novel interconnect materials 会议论文
作者:  Chan, Yan Cheong;  Li, Yi;  Wu, Fengshun;  Chen, Zhong
收藏  |  浏览/下载：3/0  |  提交时间：2019/11/26
Effect of Sn grain orientation on Cu diffusion in SnAgCu solder interconnect undergoing electromigration 会议论文
16 int conf elect packaging technology, Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA, 2015-08-11
作者:  Zhao, Jianfei;  Huang, Mingliang;  Zhao, Ning;  Zhang, Zhijie
收藏  |  浏览/下载：25/0  |  提交时间：2019/12/09
Carbon nanotube/solder hybrid structure for interconnect applications 会议论文
5th Electronics System-Integration Technology Conference, ESTC 2014, 2014-09-16
作者:  Jiang, Di[1];  Sun, Shuangxi[2];  Mu, Wei[3];  Fu, Yifeng[4];  Liu, Johan[5]
收藏  |  浏览/下载：3/0  |  提交时间：2019/04/30
Electromigration induced microstructure evolution and damage in asymmetric Cu/Sn-58Bi/Cu solder interconnect under current stressing (EI收录SCI收录) 期刊论文
Transactions of Nonferrous Metals Society of China (English Edition), 2014, 卷号: 24, 页码: 1619-1628
作者:  Yue, Wu[1];  Qin, Hong-Bo[1];  Zhou, Min-Bo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1]
收藏  |  浏览/下载：6/0  |  提交时间：2019/04/25
Effect of electromigration on the tensile strength of Cu/Sn-9Zn/Cu solder interconnects 会议论文
15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12
作者:  Huang, Mingliang;  Zhang, Fei;  Yang, Fan;  Zhao, Ning
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/09
Reverse Polarity Effect in Cu/Sn-9Zn/Ni Interconnect under High Current Density at High Temperature 会议论文
15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12
作者:  Huang, Mingliang;  Zhang, Zhijie;  Zhao, Ning;  Feng, Xiaofei
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09

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