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CORC

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Responsivity improvement of a packaged ZnMgO solar blind ultraviolet photodetector via a sealing treatment of silica gel 期刊论文
Journal of Materials Chemistry C, 2020, 卷号: 8, 期号: 3, 页码: 1089-1094
作者:  X. Chen,L. Y. Wang,K. W. Liu,Z. Z. Zhang,B. H. Li,J. B. Wu,J. Y. Wang,Y. X. Ni and D. Z. Shen
收藏  |  浏览/下载：2/0  |  提交时间：2021/07/06
Preparation of highly conductive silver nanowires for electrically conductive adhesives 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 15786-15794
作者:  Lu, Jing;  Liu, Di;  Dai, Junfu
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/30
In Situ Generation of Photosensitive Silver Halide for Improving the Conductivity of Electrically Conductive Adhesives 期刊论文
ACS APPLIED MATERIALS & INTERFACES, 2017
作者:  Li, Chaowei（李朝威）;  Li, Qiulong;  Long, Xiaoyang;  Li, Taotao;  Zhao, Jingxin
收藏  |  浏览/下载：21/0  |  提交时间：2018/02/05
Binary Synergistic Sensitivity Strengthening of Bioinspired Hierarchical Architectures based on Fragmentized Reduced Graphene Oxide Sponge and Silver Nanoparticles for Strain Sensors and Beyond 期刊论文
SMALL, 2017
Zhao, Songfang; Guo, Lingzhi; Li, Jinhui; Li, Ning; Zhang, Guoping; Gao, Yongju; Li, Jia; Cao, Duxia; Wang, Wei; Jin, Yufeng; Sun, Rong; Wong, Ching-Ping
收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03
Improved Reliability of Electrically Conductive Adhesives Joints on Cu-Plated PCB Substrate Enhanced by Graphene Protection Barrier 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Huang, Shirong[1];  Ke, Wei[2];  Yang, Yiqun[3];  Ye, Hui[4];  Chen, Shujing[5]
收藏  |  浏览/下载：41/0  |  提交时间：2019/04/24
Preparation of highly conductive adhesives by in-stiu incorporation of silver nanoparticles 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:  Yankang Han;  Baotan Zhang;  Pengli Zhu;  Shulei Huang;  Qianqian Liu
收藏  |  浏览/下载：32/0  |  提交时间：2017/01/15
Silver flakes filled Interpenetrating Polymer Network (IPN): high performance electrically conductive adhesives for electronic packaging 会议论文
China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China
作者:  Yankang Han;  Baotan Zhang;  Pengli Zhu;  Shulei Huang;  Rong Sun
收藏  |  浏览/下载：23/0  |  提交时间：2017/01/15
Electrically conductive adhesives based on thermoplastic polyurethane filled with carbon nanotubes 期刊论文
China Semiconductor Technology International Conference 2016, CSTIC 2016, 2016
作者:  Luo, Jie(罗杰);  Zhao, Yue;  Chen;  Minghai(陈名海);  Yao, Yagang(姚亚刚)
收藏  |  浏览/下载：21/0  |  提交时间：2017/03/11
Green synthesis of AgNPs/reduced graphene oxide nanocomposites and effect on the electrical performance of electrically conductive adhesives 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2016, 卷号: 27, 期号: 4
作者:  Zeng, JF;  Tian, X;  Song, JS;  Wei, Z;  Harrington, S
收藏  |  浏览/下载：28/0  |  提交时间：2017/03/11
Process Development of a New TGV Interposer for Wafer Level Package of Inertial MEMS Device 其他
2016-01-01
Ma, Shenglin; Ren, Kuili; Xia, Yanming; Yan, Jun; Luo, Rongfeng; Cai, Han; Jin, Yufeng; Ma, Mingjun; Jin, Zhonghe; Chen, Jing
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03

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